Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8093707 | Leadframe packages having enhanced ground-bond reliability | Shaw Wei Lee, Ein Sun Ng, Lee Han Meng@Eugene Lee, Yee Kim Lee | 2012-01-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8093707 | Leadframe packages having enhanced ground-bond reliability | Shaw Wei Lee, Ein Sun Ng, Lee Han Meng@Eugene Lee, Yee Kim Lee | 2012-01-10 |