Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8736042 | Delamination resistant device package having raised bond surface and mold locking aperture | Felix C. Li, Peng-Soon Lim, Terh Kuen Yii, Lee Han Meng@Eugene Lee | 2014-05-27 |
| 8097934 | Delamination resistant device package having low moisture sensitivity | Felix C. Li, Peng-Soon Lim, Terh Kuen Yii, Lee Han Meng@Eugene Lee | 2012-01-17 |
| 8093707 | Leadframe packages having enhanced ground-bond reliability | Shaw Wei Lee, Ein Sun Ng, Chue Siak Liu, Lee Han Meng@Eugene Lee | 2012-01-10 |
| 7838980 | TO263 device package having low moisture sensitivity | Peng-Soon Lim, Terh Kuen Yii, Lee Han Meng@Eugene Lee | 2010-11-23 |