Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12430352 | Methods and system for detecting unmanaged resources in cloud-based data warehousing system | Hiren Shah, Ganesh Bharathan, Sridhar Maramreddy, Naga Venkata Sriram Vadakattu, Naveen Kumar Kilaru +5 more | 2025-09-30 |
| 12189645 | Methods and systems for generating recommendations in cloud-based data warehousing system | Hiren Shah, Ganesh Bharathan, Sridhar Maramreddy, Naga Venkata Sriram Vadakattu, Naveen Kumar Kilaru +5 more | 2025-01-07 |
| 12147687 | System and method for dynamic cloud-based storage system deployment | Phil (Jingliang) Zhang, Dmitry Vladimirovich Krivenok | 2024-11-19 |
| 12019648 | Methods and system for detecting unmanaged resources in cloud-based data warehousing system | Hiren Shah, Ganesh Bharathan, Sridhar Maramreddy, Naga Venkata Sriram Vadakattu, Naveen Kumar Kilaru +5 more | 2024-06-25 |
| 8736042 | Delamination resistant device package having raised bond surface and mold locking aperture | Yee Kim Lee, Peng-Soon Lim, Terh Kuen Yii, Lee Han Meng@Eugene Lee | 2014-05-27 |
| 8097934 | Delamination resistant device package having low moisture sensitivity | Yee Kim Lee, Peng-Soon Lim, Terh Kuen Yii, Lee Han Meng@Eugene Lee | 2012-01-17 |
| 7898088 | I/O pad structures for integrated circuit devices | — | 2011-03-01 |
| 7812463 | Packaging integrated circuits for high stress environments | — | 2010-10-12 |
| 7564130 | Power micro surface-mount device package | — | 2009-07-21 |
| 7479411 | Apparatus and method for forming solder seals for semiconductor flip chip packages | — | 2009-01-20 |
| 7456503 | Integrated circuit package | — | 2008-11-25 |
| 7432583 | Leadless leadframe package substitute and stack package | Jaime A. Bayan | 2008-10-07 |
| 7425503 | Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices | — | 2008-09-16 |
| 7109587 | Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices | — | 2006-09-19 |
| 7023074 | Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) | Jaime A. Bayan, Santhiran Nadarajah, Ah Lek Hu | 2006-04-04 |
| 7005728 | Lead configuration for inline packages | — | 2006-02-28 |
| 6956291 | Apparatus and method for forming solder seals for semiconductor flip chip packages | — | 2005-10-18 |
| 6872599 | Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) | Jaime A. Bayan, Santhiran Nadarajah, Ah Lek Hu | 2005-03-29 |
| 6781243 | Leadless leadframe package substitute and stack package | Jaime A. Bayan | 2004-08-24 |