Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7181835 | Universal clamping mechanism | Sharon Mei Wan Ko, Peng Yeen Chan, Jaime A. Bayan | 2007-02-27 |
| 7023074 | Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) | Felix C. Li, Jaime A. Bayan, Santhiran Nadarajah | 2006-04-04 |
| 6872599 | Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) | Felix C. Li, Jaime A. Bayan, Santhiran Nadarajah | 2005-03-29 |
| 6698088 | Universal clamping mechanism | Sharon Mei Wan Ko, Peng Yeen Chan, Jaime A. Bayan | 2004-03-02 |
| 6686652 | Locking lead tips and die attach pad for a leadless package apparatus and method | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more | 2004-02-03 |
| 6629880 | Rotary mechanical buffing method for deflashing of molded integrated circuit packages | Aik Seng Kang, Harry Kam Cheng Hong | 2003-10-07 |
| 6467278 | Cooling for singulation of composite materials in molded semiconductor packages | Sharon Mei Wan Ko, Peng Yeen Chan | 2002-10-22 |
| 6452255 | Low inductance leadless package | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more | 2002-09-17 |
| 6399415 | Electrical isolation in panels of leadless IC packages | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more | 2002-06-04 |