Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7470978 | Sawn power package and method of fabricating same | Eng Hwa Tan, Peng-Soon Lim | 2008-12-30 |
| 7419855 | Apparatus and method for miniature semiconductor packages | Shaw Wei Lee, Nghia Thuc Tu, Lim Peng Soon | 2008-09-02 |
| 7342297 | Sawn power package | Eng Hwa Tan, Peng-Soon Lim | 2008-03-11 |
| 7259460 | Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package | Jamie A. BAYAN, Ashok S. Prabhu, Chan Peng Yeen, Hasfiza Ramley | 2007-08-21 |
| 7227245 | Die attach pad for use in semiconductor manufacturing and method of making same | Jaime A. Bayan, Chan Peng Yee | 2007-06-05 |
| 7187075 | Stress relieving film for semiconductor packages | Tan Hwa, Lim Peng Soon, Ong Sze Yan | 2007-03-06 |
| 7186588 | Method of fabricating a micro-array integrated circuit package | Jaime A. Bayan, Chan Chee Ling, Ashok S. Prabhu, Hasfiza Ramley, Chan Peng Yeen | 2007-03-06 |
| 7161232 | Apparatus and method for miniature semiconductor packages | Shaw Wei Lee, Nghia Thuc Tu, Lim Peng Soon | 2007-01-09 |
| 7064419 | Die attach region for use in a micro-array integrated circuit package | Jaime A. Bayan, Ashok S. Prabhu, Chan Chee Ling, Lye Meng Kong | 2006-06-20 |
| 7023074 | Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) | Felix C. Li, Jaime A. Bayan, Ah Lek Hu | 2006-04-04 |
| 7002239 | Leadless leadframe packaging panel featuring peripheral dummy leads | Sharon Ko Mei Wan, Chan Peng Yeen | 2006-02-21 |
| 6963124 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2005-11-08 |
| 6933174 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2005-08-23 |
| 6872599 | Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP) | Felix C. Li, Jaime A. Bayan, Ah Lek Hu | 2005-03-29 |
| 6818970 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-11-16 |
| 6808961 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-10-26 |
| 6686652 | Locking lead tips and die attach pad for a leadless package apparatus and method | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko +2 more | 2004-02-03 |
| 6677667 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-01-13 |
| 6576989 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2003-06-10 |
| 6452255 | Low inductance leadless package | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko +2 more | 2002-09-17 |
| 6448107 | Pin indicator for leadless leadframe packages | Harry Kam Cheng Hong, Hu Ah Lek, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2002-09-10 |
| 6399415 | Electrical isolation in panels of leadless IC packages | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko +2 more | 2002-06-04 |