Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8857047 | Thin foil semiconductor package | Jaime A. Bayan, Will K. Wong, David Chin | 2014-10-14 |
| 8747640 | Foil plating for semiconductor packaging | Jaime A. Bayan, Will K. Wong | 2014-06-10 |
| 8389334 | Foil-based method for packaging intergrated circuits | Aninyda Poddar, Hau Nguyen | 2013-03-05 |
| 8377267 | Foil plating for semiconductor packaging | Jaime A. Bayan, Will K. Wong | 2013-02-19 |
| 8375577 | Method of making foil based semiconductor package | Will K. Wong, Jaime A. Bayan, David Chin | 2013-02-19 |
| 8341828 | Thin foil semiconductor package | Jaime A. Bayan, Will K. Wong, David Chin | 2013-01-01 |
| 8298871 | Method and leadframe for packaging integrated circuits | Will K. Wong, Jaime A. Bayan | 2012-10-30 |
| 8293573 | Microarray package with plated contact pedestals | Jaime A. Bayan | 2012-10-23 |
| 8101470 | Foil based semiconductor package | Anindya Poddar, Jaime A. Bayan, Will K. Wong, David Chin | 2012-01-24 |
| 7893523 | Microarray package with plated contact pedestals | Jaime A. Bayan | 2011-02-22 |
| 7859090 | Die attach method and leadframe structure | Jaime A. Bayan, Lim Fong, Chan Peng Yeen | 2010-12-28 |
| 7846775 | Universal lead frame for micro-array packages | Shaw Wei Lee, Sadanand R. Patil | 2010-12-07 |
| 7836586 | Thin foil semiconductor package | Jaime A. Bayan, Will K. Wong, David Chin | 2010-11-23 |
| 7671452 | Microarray package with plated contact pedestals | Jaime A. Bayan | 2010-03-02 |
| 7598122 | Die attach method and microarray leadframe structure | Jaime A. Bayan, Lim Fong, Chan Peng Yeen | 2009-10-06 |
| 7491625 | Gang flipping for IC packaging | Jaime A. Bayan, Anindya Poddar, Ashok S. Prabhu | 2009-02-17 |
| 7419855 | Apparatus and method for miniature semiconductor packages | Shaw Wei Lee, Santhiran Nadarajah, Lim Peng Soon | 2008-09-02 |
| 7161232 | Apparatus and method for miniature semiconductor packages | Shaw Wei Lee, Santhiran Nadarajah, Lim Peng Soon | 2007-01-09 |
| 6933212 | Apparatus and method for dicing semiconductor wafers | Shaw Wei Lee, Sadanand R. Patil, Visvamohan Yegnashankaran | 2005-08-23 |
| 6723585 | Leadless package | Shaw Wei Lee, Sadanand R. Patil | 2004-04-20 |