| 12272626 |
Conductive members atop semiconductor packages |
Makoto Shibuya, Masamitsu Matsuura, Kengo Aoya |
2025-04-08 |
|
| 12160219 |
Metal ribs in electromechanical devices |
Hau Nguyen, Masamitsu Matsuura |
2024-12-03 |
$71,349,000 |
| 12154861 |
Frame design in embedded die package |
Woochan Kim, Masamitsu Matasuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +2 more |
2024-11-26 |
$43,726,000 |
| 12125799 |
Embedded die packaging with integrated ceramic substrate |
Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora |
2024-10-22 |
$67,374,000 |
| 12074134 |
Package for stress sensitive component and semiconductor device |
Mahmud Halim Chowdhury, Hau Nguyen, Masamitsu Matsuura, Ting-Ta Yen |
2024-08-27 |
$38,380,000 |
| 12057264 |
Forming integrated inductors and transformers with embedded magnetic cores |
— |
2024-08-06 |
$46,957,000 |
| 12021019 |
Semiconductor device package with thermal pad |
Ashok S. Prabhu, Edgar Dorotyao Balidoy, Hau Nguyen, Makoto Yoshino, Ming-Yang Li |
2024-06-25 |
$36,060,000 |
| 12009336 |
Packages with electrical fuses |
Mahmud Halim Chowdhury, Amin Ahmad Sijelmassi, Murali Kittappa, Honglin Guo, Joe Adam Garcia +1 more |
2024-06-11 |
$44,466,000 |
| 11955456 |
Flip chip packaged devices with thermal pad |
Ashok S. Prabhu, Hau Nguyen, Kurt Sincerbox, Makoto Shibuya |
2024-04-09 |
$37,776,000 |
| 11942384 |
Semiconductor package having an interdigitated mold arrangement |
Makoto Shibuya, Masamitsu Matsuura, Kengo Aoya, Hideaki Matsunaga |
2024-03-26 |
$28,354,000 |
| 11923281 |
Semiconductor package with isolated heat spreader |
Woochan Kim, Vivek Kishorechand Arora |
2024-03-05 |
$28,640,000 |
| 11736085 |
Metal ribs in electromechanical devices |
Hau Nguyen, Masamitsu Matsuura |
2023-08-22 |
$37,485,000 |
| 11538717 |
Electronic package for integrated circuits and related methods |
Kurt Peter Wachtler, Usman Mahmood Chaudhry |
2022-12-27 |
$29,539,000 |
| 11450638 |
Bump bond structure for enhanced electromigration performance |
Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Makoto Yoshino +1 more |
2022-09-20 |
$47,694,000 |
| 11430722 |
Integration of a passive component in a cavity of an integrated circuit package |
Jeffrey Anthony Morroni, Rajeev Joshi, Sreenivasan K. Koduri, Sujan Kundapur Manohar, Yogesh Kumar Ramadass |
2022-08-30 |
$35,135,000 |
| 11417579 |
Packaged semiconductor devices for high voltage with die edge protection |
Woochan Kim, Vivek Kishorechand Arora |
2022-08-16 |
$28,299,000 |
| 11410875 |
Fan-out electronic device |
Hau Nguyen, Woochan Kim, Yi Yan, Luu Thanh Nguyen, Ashok S. Prabhu +3 more |
2022-08-09 |
$38,405,000 |
| 11367699 |
Integrated circuit backside metallization |
Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu +2 more |
2022-06-21 |
$32,959,000 |
| 11302615 |
Semiconductor package with isolated heat spreader |
Woochan Kim, Vivek Kishorechand Arora |
2022-04-12 |
$29,056,000 |
| 11183460 |
Embedded die packaging with integrated ceramic substrate |
Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora |
2021-11-23 |
$48,071,000 |
| 11183441 |
Stress buffer layer in embedded package |
Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more |
2021-11-23 |
$48,071,000 |
| 11158595 |
Embedded die package multichip module |
Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more |
2021-10-26 |
$44,233,000 |
| 11021786 |
Copper passivation |
Luu Thanh Nguyen, Mahmud Halim Chowdhury, Ashok S. Prabhu |
2021-06-01 |
$28,896,000 |
| 10879155 |
Electronic device with double-sided cooling |
Woochan Kim, Vivek Kishorechand Arora |
2020-12-29 |
$32,545,000 |
| 10861741 |
Electronic package for integrated circuits and related methods |
Kurt Peter Wachtler, Usman Mahmood Chaudhry |
2020-12-08 |
$35,035,000 |