Issued Patents All Time
Showing 25 most recent of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272626 | Conductive members atop semiconductor packages | Makoto Shibuya, Masamitsu Matsuura, Kengo Aoya | 2025-04-08 |
| 12160219 | Metal ribs in electromechanical devices | Hau Nguyen, Masamitsu Matsuura | 2024-12-03 |
| 12154861 | Frame design in embedded die package | Woochan Kim, Masamitsu Matasuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +2 more | 2024-11-26 |
| 12125799 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora | 2024-10-22 |
| 12074134 | Package for stress sensitive component and semiconductor device | Mahmud Halim Chowdhury, Hau Nguyen, Masamitsu Matsuura, Ting-Ta Yen | 2024-08-27 |
| 12057264 | Forming integrated inductors and transformers with embedded magnetic cores | — | 2024-08-06 |
| 12021019 | Semiconductor device package with thermal pad | Ashok S. Prabhu, Edgar Dorotyao Balidoy, Hau Nguyen, Makoto Yoshino, Ming-Yang Li | 2024-06-25 |
| 12009336 | Packages with electrical fuses | Mahmud Halim Chowdhury, Amin Ahmad Sijelmassi, Murali Kittappa, Honglin Guo, Joe Adam Garcia +1 more | 2024-06-11 |
| 11955456 | Flip chip packaged devices with thermal pad | Ashok S. Prabhu, Hau Nguyen, Kurt Sincerbox, Makoto Shibuya | 2024-04-09 |
| 11942384 | Semiconductor package having an interdigitated mold arrangement | Makoto Shibuya, Masamitsu Matsuura, Kengo Aoya, Hideaki Matsunaga | 2024-03-26 |
| 11923281 | Semiconductor package with isolated heat spreader | Woochan Kim, Vivek Kishorechand Arora | 2024-03-05 |
| 11736085 | Metal ribs in electromechanical devices | Hau Nguyen, Masamitsu Matsuura | 2023-08-22 |
| 11538717 | Electronic package for integrated circuits and related methods | Kurt Peter Wachtler, Usman Mahmood Chaudhry | 2022-12-27 |
| 11450638 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Makoto Yoshino +1 more | 2022-09-20 |
| 11430722 | Integration of a passive component in a cavity of an integrated circuit package | Jeffrey Anthony Morroni, Rajeev Joshi, Sreenivasan K. Koduri, Sujan Kundapur Manohar, Yogesh Kumar Ramadass | 2022-08-30 |
| 11417579 | Packaged semiconductor devices for high voltage with die edge protection | Woochan Kim, Vivek Kishorechand Arora | 2022-08-16 |
| 11410875 | Fan-out electronic device | Hau Nguyen, Woochan Kim, Yi Yan, Luu Thanh Nguyen, Ashok S. Prabhu +3 more | 2022-08-09 |
| 11367699 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu +2 more | 2022-06-21 |
| 11302615 | Semiconductor package with isolated heat spreader | Woochan Kim, Vivek Kishorechand Arora | 2022-04-12 |
| 11183460 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora | 2021-11-23 |
| 11183441 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more | 2021-11-23 |
| 11158595 | Embedded die package multichip module | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more | 2021-10-26 |
| 11021786 | Copper passivation | Luu Thanh Nguyen, Mahmud Halim Chowdhury, Ashok S. Prabhu | 2021-06-01 |
| 10879155 | Electronic device with double-sided cooling | Woochan Kim, Vivek Kishorechand Arora | 2020-12-29 |
| 10861741 | Electronic package for integrated circuits and related methods | Kurt Peter Wachtler, Usman Mahmood Chaudhry | 2020-12-08 |