Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412840 | Power module with multi-layer substrate and second insulation layer to increase power density | Kwnag-Soo Kim, Woochan Kim | 2025-09-09 |
| 12400939 | Packaged semiconductor device including heat slug | Ken Pham, Woochan Kim | 2025-08-26 |
| 12154861 | Frame design in embedded die package | Woochan Kim, Masamitsu Matasuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +2 more | 2024-11-26 |
| 12136588 | Heat slug attached to a die pad for semiconductor package | Woochan Kim | 2024-11-05 |
| 12125799 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Anindya Poddar | 2024-10-22 |
| 11929311 | Isolated semiconductor package with HV isolator on block | Woochan Kim | 2024-03-12 |
| 11923281 | Semiconductor package with isolated heat spreader | Anindya Poddar, Woochan Kim | 2024-03-05 |
| 11908834 | Multi-chip package with reinforced isolation | Woochan Kim | 2024-02-20 |
| 11869839 | Package panel processing with integrated ceramic isolation | Woochan Kim, Benjamin A. Samples | 2024-01-09 |
| 11870341 | Isolated power converter package with molded transformer | Yi Yan | 2024-01-09 |
| 11751353 | Power conversion module and method of forming the same | Woochan Kim, David Huitink, Hayden Seth Carlton, Fang-Chen Luo, Asif Imran Emon | 2023-09-05 |
| 11715679 | Power stage package including flexible circuit and stacked die | Woochan Kim | 2023-08-01 |
| 11601065 | Power converter module | Woochan Kim, Makoto Shibuya, Kengo Aoya | 2023-03-07 |
| 11417579 | Packaged semiconductor devices for high voltage with die edge protection | Woochan Kim, Anindya Poddar | 2022-08-16 |
| 11387179 | IC package with half-bridge power module | Makoto Shibuya, Kengo Aoya, Woochan Kim | 2022-07-12 |
| 11329025 | Multi-chip package with reinforced isolation | Woochan Kim | 2022-05-10 |
| 11302615 | Semiconductor package with isolated heat spreader | Anindya Poddar, Woochan Kim | 2022-04-12 |
| 11183460 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Mutsumi Masumoto, Kengo Aoya, Anindya Poddar | 2021-11-23 |
| 11183441 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more | 2021-11-23 |
| 11158567 | Package with stacked power stage and integrated control die | Woochan Kim, Benjamin A. Samples | 2021-10-26 |
| 11158595 | Embedded die package multichip module | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more | 2021-10-26 |
| 11075147 | Stacked die semiconductor package | Woochan Kim, Ken Pham | 2021-07-27 |
| 11031332 | Package panel processing with integrated ceramic isolation | Woochan Kim, Benjamin A. Samples | 2021-06-08 |
| 10919929 | Glucocorticoid inhibitors for treatment of prostate cancer | Charles L. Sawyers, Michael J. Evans, Darren R. Veach | 2021-02-16 |
| 10879155 | Electronic device with double-sided cooling | Woochan Kim, Anindya Poddar | 2020-12-29 |