Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11984433 | Arrangements of power semiconductor devices for improved thermal performance | Brice McPherson, Brandon Passmore | 2024-05-14 | $51,975,000 |
| 11869839 | Package panel processing with integrated ceramic isolation | Woochan Kim, Vivek Kishorechand Arora | 2024-01-09 | $22,697,000 |
| 11158567 | Package with stacked power stage and integrated control die | Woochan Kim, Vivek Kishorechand Arora | 2021-10-26 | $44,233,000 |
| 11031332 | Package panel processing with integrated ceramic isolation | Woochan Kim, Vivek Kishorechand Arora | 2021-06-08 | $50,580,000 |
| 10522443 | Lid cover spring design | John Fredrick May | 2019-12-31 | |
| 8410601 | RF package | — | 2013-04-02 | $10,565,000 |
| 8034666 | Multi-layer thick-film RF package | — | 2011-10-11 | $5,451,000 |