Issued Patents All Time
Showing 25 most recent of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12413332 | Method and apparatus for transmitting and receiving data in wireless communication system supporting full-duplex radio | Dongsoo Shin | 2025-09-09 |
| 12412840 | Power module with multi-layer substrate and second insulation layer to increase power density | Kwnag-Soo Kim, Vivek Kishorechand Arora | 2025-09-09 |
| 12400939 | Packaged semiconductor device including heat slug | Ken Pham, Vivek Kishorechand Arora | 2025-08-26 |
| 12394742 | Interconnect structure for high power GaN module including a printed planar interconnect line and method for making the same | Jie Chen, Yong Xie, Rajen Manicon Murugan | 2025-08-19 |
| 12363644 | Wireless communication system supporting full duplex radio, and apparatus therefor | Daegeun KANG, Jongpil Lee | 2025-07-15 |
| 12347742 | IC package with heat spreader | Rongwei Zhang, Patrick Francis Thompson | 2025-07-01 |
| 12250568 | Method and apparatus for reducing interference effects in wireless communication systems | Yonghak Suh | 2025-03-11 |
| 12154861 | Frame design in embedded die package | Masamitsu Matasuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +2 more | 2024-11-26 |
| 12138367 | Plasma-assisted flexible multi-scale topographic patches for engineering cellular behavior and tissue regeneration | Jangho Kim | 2024-11-12 |
| 12136588 | Heat slug attached to a die pad for semiconductor package | Vivek Kishorechand Arora | 2024-11-05 |
| 12125799 | Embedded die packaging with integrated ceramic substrate | Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora, Anindya Poddar | 2024-10-22 |
| 12019861 | Electronic apparatus and the method for controlling thereof | Junhwa OH, Dahye Kim, Sookkyung Lee, Hyunbin Lee, Dale AHN +1 more | 2024-06-25 |
| 12009280 | IC package with heat spreader | Rongwei Zhang, Patrick Francis Thompson | 2024-06-11 |
| 11982782 | Method and device for analyzing 3D target maneuver using line array sensor | Taeil Suh | 2024-05-14 |
| 11930378 | Apparatus and method for performing calibration in wireless communication system | Jongpil Lee, Soo-Jin Kim | 2024-03-12 |
| 11929311 | Isolated semiconductor package with HV isolator on block | Vivek Kishorechand Arora | 2024-03-12 |
| 11923281 | Semiconductor package with isolated heat spreader | Anindya Poddar, Vivek Kishorechand Arora | 2024-03-05 |
| 11908834 | Multi-chip package with reinforced isolation | Vivek Kishorechand Arora | 2024-02-20 |
| 11869839 | Package panel processing with integrated ceramic isolation | Benjamin A. Samples, Vivek Kishorechand Arora | 2024-01-09 |
| 11751229 | Method of transmitting and receiving data in wireless communication system supporting full-duplex radio and apparatus therefor | Jongpil Lee, Dongsoo Shin, Soojin Kim, Donggeun Kim | 2023-09-05 |
| 11751353 | Power conversion module and method of forming the same | Vivek Kishorechand Arora, David Huitink, Hayden Seth Carlton, Fang-Chen Luo, Asif Imran Emon | 2023-09-05 |
| 11715679 | Power stage package including flexible circuit and stacked die | Vivek Kishorechand Arora | 2023-08-01 |
| 11696285 | Method and apparatus for transmitting a signal in a wireless communication system | Yong Hak Suh | 2023-07-04 |
| 11683146 | Method and apparatus for transmitting and receiving a signal in a wireless communication system | Chul Kyu Mun | 2023-06-20 |
| 11649555 | Electroplating apparatus and electroplating method using the same | Gotae Kim, Changjun Choi, SangCheol Moon, Wook Kim | 2023-05-16 |