| 12427602 |
Method for realizing high-speed cladding of hollow offset-focus annular laser |
Tuo Shi, Geyan Fu, Shihong SHI, Yu-Hsiang Wang |
2025-09-30 |
|
| 12364052 |
Integrated filter optical package |
Steven Kummerl, Simon Joshua Jacobs, James R. Huckabee, Jo Bito |
2025-07-15 |
|
| 12347742 |
IC package with heat spreader |
Woochan Kim, Patrick Francis Thompson |
2025-07-01 |
|
| 12199008 |
Package heat dissipation including a die attach film |
Jaimal Mallory Williamson |
2025-01-14 |
|
| 12062596 |
Semiconductor die with stepped side surface |
Chien-Hao Wang, Bob Lee |
2024-08-13 |
$79,387,000 |
| 12009280 |
IC package with heat spreader |
Woochan Kim, Patrick Francis Thompson |
2024-06-11 |
$44,466,000 |
| 11772193 |
Annular hollow offset-focus laser cladding device |
Tuo Shi, Geyan Fu, Shihong SHI |
2023-10-03 |
|
| 11018111 |
Wafer level derived flip chip package |
James R. Huckabee, Vikas Gupta |
2021-05-25 |
$87,337,000 |
| 10784188 |
Methods and apparatus for a semiconductor device having bi-material die attach layer |
Vikas Gupta |
2020-09-22 |
$22,203,000 |
| 10727085 |
Printed adhesion deposition to mitigate integrated circuit package delamination |
Yong Lin, Benjamin Stassen Cook, Abram Castro |
2020-07-28 |
$26,870,000 |
| 10559524 |
2-step die attach for reduced pedestal size of laminate component packages |
Sadia Naseem, Vikas Gupta |
2020-02-11 |
$30,318,000 |
| 10366944 |
Methods and apparatus for semiconductor device having bi-material die attach layer |
Vikas Gupta |
2019-07-30 |
$25,816,000 |
| 10347508 |
Printed adhesion deposition to mitigate integrated circuit delamination |
Yong Lin, Benjamin Stassen Cook, Abram Castro |
2019-07-09 |
$33,407,000 |
| 10312212 |
Self-adhesive die |
— |
2019-06-04 |
$27,113,000 |
| 10199348 |
Plastic-packaged semiconductor device having wires with polymerized insulating layer |
Abram Castro |
2019-02-05 |
$20,780,000 |
| 10083896 |
Methods and apparatus for a semiconductor device having bi-material die attach layer |
Vikas Gupta |
2018-09-25 |
$32,606,000 |
| 9780017 |
Packaged device with additive substrate surface modification |
Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Abram Castro, Matthew David Romig |
2017-10-03 |
$15,808,000 |
| 9780060 |
Packaged IC with solderable sidewalls |
Yong Lin, Vikas Gupta |
2017-10-03 |
$15,808,000 |
| 9601414 |
Method for preventing die pad delamination |
Abram Castro |
2017-03-21 |
$9,568,000 |
| 9524926 |
Packaged device with additive substrate surface modification |
Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Abram Castro, Matthew David Romig |
2016-12-20 |
$18,500,000 |
| 9490043 |
Highly conductive electrically conductive adhesives |
Ching-Ping Wong |
2016-11-08 |
|
| 9378984 |
Packaging a semiconductor device having wires with polymerized insulator skin |
Abram Castro |
2016-06-28 |
$16,410,000 |
| 9305869 |
Packaged semiconductor device having leadframe features as pressure valves against delamination |
Abram Castro |
2016-04-05 |
$12,005,000 |
| 9214440 |
Method for preventing die pad delamination |
Abram Castro |
2015-12-15 |
$26,830,000 |
| 8912637 |
Self-adhesive die |
— |
2014-12-16 |
$28,159,000 |