Patents per Year
Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12364052 | Integrated filter optical package | Steven Kummerl, Simon Joshua Jacobs, Jo Bito, Rongwei Zhang | 2025-07-15 | |
| 11018111 | Wafer level derived flip chip package | Rongwei Zhang, Vikas Gupta | 2021-05-25 | $87,337,000 |
| 8916408 | Leadframe-based premolded package having air channel for microelectromechanical system (MEMS) device | Ray H. Purdom | 2014-12-23 | $21,013,000 |
| 8530981 | Leadframe-based premolded package having acoustic air channel for micro-electro-mechanical system | Ray H. Purdom | 2013-09-10 | $8,150,000 |
| 7871864 | Locking feature and method for manufacturing transfer molded IC packages | — | 2011-01-18 | $19,351,000 |
| 7712999 | Method and apparatus for drying soil | — | 2010-05-11 | |
| 7701073 | Locking feature and method for manufacturing transfer molded IC packages | — | 2010-04-20 | $10,232,000 |