Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255077 | Method for creating a wettable surface for improved reliability in QFN packages | Sadia Naseem | 2025-03-18 |
| 11791168 | Method for creating a wettable surface for improved reliability in QFN packages | Sadia Naseem | 2023-10-17 |
| 11735806 | Wireless device with waveguiding structures between radiating structures and waveguide feeds | Meysam Moallem, Sadia Naseem | 2023-08-22 |
| 11677152 | Packaged electronic device with integral antenna | Sadia Naseem, Meysam Moallem | 2023-06-13 |
| 11598742 | Semiconductor device for sensing impedance changes in a medium | Enis Tuncer | 2023-03-07 |
| 11437333 | Packaged semiconductor device with a reflow wall | Daniel Yong Lin | 2022-09-06 |
| 11128023 | Substrate design for efficient coupling between a package and a dielectric waveguide | Hassan Ali, Juan Alejandro Herbsommer, Benjamin Stassen Cook, Athena Lin, Swaminathan Sankaran | 2021-09-21 |
| 11062982 | Packaged semiconductor device with a particle roughened surface | Daniel Yong Lin | 2021-07-13 |
| 11018111 | Wafer level derived flip chip package | Rongwei Zhang, James R. Huckabee | 2021-05-25 |
| 10916448 | Method for creating a wettable surface for improved reliability in QFN packages | Sadia Naseem | 2021-02-09 |
| 10910705 | Antenna in package device having substrate stack | Athena Lin, Juan Alejandro Herbsommer | 2021-02-02 |
| 10883953 | Semiconductor device for sensing impedance changes in a medium | Enis Tuncer | 2021-01-05 |
| 10784188 | Methods and apparatus for a semiconductor device having bi-material die attach layer | Rongwei Zhang | 2020-09-22 |
| 10559524 | 2-step die attach for reduced pedestal size of laminate component packages | Sadia Naseem, Rongwei Zhang | 2020-02-11 |
| 10475729 | Packaged semiconductor device with a particle roughened surface | Daniel Yong Lin | 2019-11-12 |
| 10366944 | Methods and apparatus for semiconductor device having bi-material die attach layer | Rongwei Zhang | 2019-07-30 |
| 10186478 | Packaged semiconductor device with a particle roughened surface | Daniel Yong Lin | 2019-01-22 |
| 10083896 | Methods and apparatus for a semiconductor device having bi-material die attach layer | Rongwei Zhang | 2018-09-25 |
| 9780060 | Packaged IC with solderable sidewalls | Yong Lin, Rongwei Zhang | 2017-10-03 |
| 9682286 | Ball for ball games, and method for manufacturing ball for ball games | Hideomi Shishido, Vinod Mahajan | 2017-06-20 |
| 8883567 | Process of making a stacked semiconductor package having a clip | Michael Todd Wyant, Patricia Sabran Conde, Rajiv Dunne, Emerson Mamaril Enipin | 2014-11-11 |
| 8506767 | Thin-film shape memory alloy device and method | A. David Johnson, Valery Martynov, Arani Bose | 2013-08-13 |
| 8378503 | Apparatus for thermal control of semiconductor chip assembly and underfill | Jeremias P. Libres, Joseph Edward Grigalunas | 2013-02-19 |
| 8304897 | Thermal interface material design for enhanced thermal performance and improved package structural integrity | Siva Prakash Gurrum, Paul J. Hundt | 2012-11-06 |
| 8129224 | Stud bumps as local heat sinks during transient power operations | Siva Prakash Gurrum, Kapil Heramb Sahasrabudhe | 2012-03-06 |