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Vikas Gupta — 45 Patents

TITexas Instruments: 34 patents #272 of 12,488Top 3%

TATini Alloy: 7 patents #3 of 21Top 15%

MIMicropyretics Heaters International: 2 patents #7 of 17Top 45%

Stryker: 2 patents #609 of 1,405Top 45%

SLStryker Nv Operations Limited: 2 patents #19 of 74Top 30%

Dallas, TX: #89 of 7,543 inventorsTop 2%

Texas: #2,078 of 125,132 inventorsTop 2%

Overall (All Time): #64,393 of 4,157,543Top 2%

45 Patents All Time

Vikas Gupta has been granted 45 US patents while listed as an inventor at Texas Instruments. The first was granted in 1997 and the most recent in March 2025. Vikas Gupta ranks #64,393 of 4,157,543 US inventors in our database (top 1.5%). Patent records list Vikas Gupta in Dallas, TX, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 45 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12255077	Method for creating a wettable surface for improved reliability in QFN packages	Sadia Naseem	2025-03-18
11791168	Method for creating a wettable surface for improved reliability in QFN packages	Sadia Naseem	2023-10-17	$20,967,000
11735806	Wireless device with waveguiding structures between radiating structures and waveguide feeds	Meysam Moallem, Sadia Naseem	2023-08-22	$37,485,000
11677152	Packaged electronic device with integral antenna	Sadia Naseem, Meysam Moallem	2023-06-13	$30,659,000
11598742	Semiconductor device for sensing impedance changes in a medium	Enis Tuncer	2023-03-07	$30,094,000
11437333	Packaged semiconductor device with a reflow wall	Daniel Yong Lin	2022-09-06	$32,761,000
11128023	Substrate design for efficient coupling between a package and a dielectric waveguide	Hassan Ali, Juan Alejandro Herbsommer, Benjamin Stassen Cook, Athena Lin, Swaminathan Sankaran	2021-09-21	$75,664,000
11062982	Packaged semiconductor device with a particle roughened surface	Daniel Yong Lin	2021-07-13	$42,316,000
11018111	Wafer level derived flip chip package	Rongwei Zhang, James R. Huckabee	2021-05-25	$87,337,000
10916448	Method for creating a wettable surface for improved reliability in QFN packages	Sadia Naseem	2021-02-09	$69,731,000
10910705	Antenna in package device having substrate stack	Athena Lin, Juan Alejandro Herbsommer	2021-02-02	$39,672,000
10883953	Semiconductor device for sensing impedance changes in a medium	Enis Tuncer	2021-01-05	$41,850,000
10784188	Methods and apparatus for a semiconductor device having bi-material die attach layer	Rongwei Zhang	2020-09-22	$22,203,000
10559524	2-step die attach for reduced pedestal size of laminate component packages	Sadia Naseem, Rongwei Zhang	2020-02-11	$30,318,000
10475729	Packaged semiconductor device with a particle roughened surface	Daniel Yong Lin	2019-11-12	$40,720,000
10366944	Methods and apparatus for semiconductor device having bi-material die attach layer	Rongwei Zhang	2019-07-30	$25,816,000
10186478	Packaged semiconductor device with a particle roughened surface	Daniel Yong Lin	2019-01-22	$26,240,000
10083896	Methods and apparatus for a semiconductor device having bi-material die attach layer	Rongwei Zhang	2018-09-25	$32,606,000
9780060	Packaged IC with solderable sidewalls	Yong Lin, Rongwei Zhang	2017-10-03	$15,808,000
9682286	Ball for ball games, and method for manufacturing ball for ball games	Hideomi Shishido, Vinod Mahajan	2017-06-20
8883567	Process of making a stacked semiconductor package having a clip	Michael Todd Wyant, Patricia Sabran Conde, Rajiv Dunne, Emerson Mamaril Enipin	2014-11-11	$11,856,000
8506767	Thin-film shape memory alloy device and method	A. David Johnson, Valery Martynov, Arani Bose	2013-08-13	$10,551,000
8378503	Apparatus for thermal control of semiconductor chip assembly and underfill	Jeremias P. Libres, Joseph Edward Grigalunas	2013-02-19	$3,880,000
8304897	Thermal interface material design for enhanced thermal performance and improved package structural integrity	Siva Prakash Gurrum, Paul J. Hundt	2012-11-06	$2,604,000
8129224	Stud bumps as local heat sinks during transient power operations	Siva Prakash Gurrum, Kapil Heramb Sahasrabudhe	2012-03-06	$7,446,000