Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862479 | MCM package isolation through leadframe design and package saw process | Bernard Kaebin Andres Ancheta, John Carlo Cruz Molina | 2024-01-02 |
| 11081366 | MCM package isolation through leadframe design and package saw process | Bernard Kaebin Andres Ancheta, John Carlo Cruz Molina | 2021-08-03 |
| 8883567 | Process of making a stacked semiconductor package having a clip | Michael Todd Wyant, Patricia Sabran Conde, Vikas Gupta, Rajiv Dunne | 2014-11-11 |