Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862479 | MCM package isolation through leadframe design and package saw process | Emerson Mamaril Enipin, John Carlo Cruz Molina | 2024-01-02 |
| 11233031 | Flip-chip on leadframe having partially etched landing sites | Ronaldo M. Arguelles, Edgar Dorotayo Balidoy, Gloria Bibal Manaois | 2022-01-25 |
| 11081366 | MCM package isolation through leadframe design and package saw process | Emerson Mamaril Enipin, John Carlo Cruz Molina | 2021-08-03 |