Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11233031 | Flip-chip on leadframe having partially etched landing sites | Edgar Dorotayo Balidoy, Gloria Bibal Manaois, Bernard Kaebin Andres Ancheta | 2022-01-25 |
| 6455922 | Deformation-absorbing leadframe for semiconductor devices | Reynante Tamunan Alvarado, Leonardo S. Rimpillo, Jr., Teddy D. Weygan | 2002-09-24 |
| 6271109 | Substrate for accommodating warped semiconductor devices | Teddy D. Weygan, Ferdinand Arabe | 2001-08-07 |
| 5949138 | Heat spreader | Primitivo A. Palasi, Philip Simon | 1999-09-07 |