Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545411 | Package comprising wire bonds configured as a heat spreader | Wen Yin, Yonghao An | 2023-01-03 |
| 10163687 | System, apparatus, and method for embedding a 3D component with an interconnect structure | David Fraser Rae, Lizabeth Keser | 2018-12-25 |
| 10141202 | Semiconductor device comprising mold for top side and sidewall protection | Lizabeth Keser, Jianwen Xu | 2018-11-27 |
| 9985010 | System, apparatus, and method for embedding a device in a faceup workpiece | David Fraser Rae, Lizabeth Keser | 2018-05-29 |
| 9806048 | Planar fan-out wafer level packaging | Lizabeth Keser, David Fraser Rae | 2017-10-31 |
| 9806052 | Semiconductor package interconnect | Lizabeth Keser | 2017-10-31 |
| 9425160 | Wafer-level package device with solder bump reinforcement | Yi-Sheng Anthony Sun, Arkadii V. Samoilov, Yong Li Xu | 2016-08-23 |
| 9379065 | Crack stopping structure in wafer level packaging (WLP) | Lizabeth Keser, Zhongping Bao | 2016-06-28 |
| 9209110 | Integrated device comprising wires as vias in an encapsulation layer | Lizabeth Keser, Steve Joseph Bezuk | 2015-12-08 |
| 9171782 | Stacked redistribution layers on die | Christine Hau-Riege, You-Wen Yau, Kevin Patrick Caffey, Lizabeth Keser, Gene H. McAllister +2 more | 2015-10-27 |
| 9159684 | Wafer-level packaged device having self-assembled resilient leads | Chiung C. Lo, Arkadii V. Samoilov | 2015-10-13 |
| 8692367 | Wafer-level packaged device having self-assembled resilient leads | Chiung C. Lo, Arkadii V. Samoilov | 2014-04-08 |
| 8686560 | Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress | Pirooz Parvarandeh, Chiung C. Lo, Arkadii V. Samoilov | 2014-04-01 |
| 8446019 | Solder bump interconnect | Yuan Lu, Richard Redburn | 2013-05-21 |
| 8278748 | Wafer-level packaged device having self-assembled resilient leads | Chiung C. Lo, Arkadii V. Samoilov | 2012-10-02 |
| 8188606 | Solder bump interconnect | Yuan Lu, Richard Redburn | 2012-05-29 |
| 7973418 | Solder bump interconnect for improved mechanical and thermo-mechanical performance | Yuan Lu, Richard Redburn | 2011-07-05 |
| 6455922 | Deformation-absorbing leadframe for semiconductor devices | Ronaldo M. Arguelles, Leonardo S. Rimpillo, Jr., Teddy D. Weygan | 2002-09-24 |