Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583425 | Solder fatigue arrest for wafer level package | Tiao Zhou, Xiansong Chen, Kaysar Rahim, Viren Khandekar, Yi-Sheng Anthony Sun +1 more | 2017-02-28 |
| 9425160 | Wafer-level package device with solder bump reinforcement | Reynante Tamunan Alvarado, Yi-Sheng Anthony Sun, Arkadii V. Samoilov | 2016-08-23 |
| 9397027 | Sacrificial pad on semiconductor package device and method | Xiansong Chen, Yi-Sheng Anthony Sun, Kumar Nagarajan, Satbir Madra | 2016-07-19 |
| 9093333 | Integrated circuit device having extended under ball metallization | Duane Thomas Wilcoxen, Yi-Sheng Anthony Sun, Viren Khandekar, Arkadii V. Samoilov | 2015-07-28 |
| 9087732 | Wafer-level package device having solder bump assemblies that include an inner pillar structure | Viren Khandekar, Yi-Sheng Anthony Sun, Arkadii V. Samoilov | 2015-07-21 |
| 9040408 | Techniques for wafer-level processing of QFN packages | Tiao Zhou, Joseph W. Serpiello, Md. Kaysar Rahim, Karthik Thambidurai, Viren Khandekar | 2015-05-26 |
| 8643150 | Wafer-level package device having solder bump assemblies that include an inner pillar structure | Viren Khandekar, Yi-Sheng Anthony Sun, Arkadii V. Samoilov | 2014-02-04 |
| 8575493 | Integrated circuit device having extended under ball metallization | Duane Thomas Wilcoxen, Yi-Sheng Anthony Sun, Viren Khandekar, Arkadii V. Samoilov | 2013-11-05 |
| 8084871 | Redistribution layer enhancement to improve reliability of wafer level packaging | S. Kaysar Rahim, Tiao Zhou, Arkadii V. Samoilov, Viren Khandekar | 2011-12-27 |
| 7382059 | Semiconductor package structure and method of manufacture | Harold Anderson, Cang Ngo, James W. Mohr | 2008-06-03 |