Issued Patents All Time
Showing 1–25 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475937 | Optical sensor packages employing cloaking layers | Joy T. Jones, John Hanks, Craig A. Easson | 2019-11-12 |
| 10439118 | MEMS-based wafer level packaging for thermo-electric IR detectors | Arvin Emadi, Nicole D. Kerness, Abhishek Sahasrabudhe | 2019-10-08 |
| 10268864 | High-resolution electric field sensor in cover glass | Richard S. Withers, Ronald B. Koo, Stephen C. Gerber, David Johnson | 2019-04-23 |
| 10168211 | Fully integrated gas concentration sensor | Arvin Emadi, Nicole D. Kerness | 2019-01-01 |
| 10132679 | Ultraviolet sensor having filter | Arvin Emadi, Nicole D. Kerness, Cheng-Wei Pei, Joy T. Jones, Ke Zeng | 2018-11-20 |
| 9966350 | Wafer-level package device | Vijay Ullal | 2018-05-08 |
| 9851250 | Fully integrated gas concentration sensor | Arvin Emadi, Nicole D. Kerness | 2017-12-26 |
| 9837368 | Enhanced board level reliability for wafer level packages | Peter R. Harper, Martin Mason | 2017-12-05 |
| 9806047 | Wafer level device and method with cantilever pillar structure | Karthik Thambidurai, Peter R. Harper, Sriram Muthukumar | 2017-10-31 |
| 9704809 | Fan-out and heterogeneous packaging of electronic components | Khanh Tran, Pirooz Parvarandeh, Amit S. Kelkar | 2017-07-11 |
| 9659900 | Semiconductor device having a die and through-substrate via | Xuejun Ying, Peter McNally, Tyler Parent | 2017-05-23 |
| 9583425 | Solder fatigue arrest for wafer level package | Yong Li Xu, Tiao Zhou, Xiansong Chen, Kaysar Rahim, Viren Khandekar +1 more | 2017-02-28 |
| 9558390 | High-resolution electric field sensor in cover glass | Richard S. Withers, Ronald B. Koo, Stephen C. Gerber, David Johnson | 2017-01-31 |
| 9472696 | Light sensor having a contiguous IR suppression filter and transparent substrate | Nicole D. Kerness, Zhihai Wang, Joy T. Jones | 2016-10-18 |
| 9472586 | Light sensor having transparent substrate and through-substrate vias and a contiguous IR suppression filter | Nicole D. Kerness, Zhihai Wang, Joy T. Jones | 2016-10-18 |
| 9425160 | Wafer-level package device with solder bump reinforcement | Reynante Tamunan Alvarado, Yi-Sheng Anthony Sun, Yong Li Xu | 2016-08-23 |
| 9354111 | Wafer level lens in package | Nicole D. Kerness, Jerome Chandra Bhat, Anand Chamakura, Kumar Nagarajan, Christopher F. Edwards | 2016-05-31 |
| 9343430 | Stacked wafer-level package device | Tie Wang, Yi-Sheng Anthony Sun | 2016-05-17 |
| 9322901 | Multichip wafer level package (WLP) optical device | Nicole D. Kerness, Joy T. Jones, Christopher F. Edwards, Phillip J. Benzel, Richard Ian Olsen +1 more | 2016-04-26 |
| 9230903 | Multi-die, high current wafer level package | Peter R. Harper, Viren Khandekar, Pirooz Parvarandeh | 2016-01-05 |
| 9224714 | Semiconductor device having a through-substrate via | Tyler Parent, Larry Wang | 2015-12-29 |
| 9224884 | Light sensor having transparent substrate and diffuser formed therein | Nicole D. Kerness, Zhihai Wang, Joy T. Jones | 2015-12-29 |
| 9224890 | Light sensor having transparent substrate with lens formed therein | Nicole D. Kerness, Zhihai Wang, Joy T. Jones | 2015-12-29 |
| 9196587 | Semiconductor device having a die and through substrate-via | Xuejun Ying, Peter McNally, Tyler Parent | 2015-11-24 |
| 9159684 | Wafer-level packaged device having self-assembled resilient leads | Chiung C. Lo, Reynante Tamunan Alvarado | 2015-10-13 |