Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966350 | Wafer-level package device | Arkadii V. Samoilov | 2018-05-08 |
| 9478519 | Package including a semiconductor die and a capacitive component | Ahmad Ashrafzadeh, Justin Chiang, Daniel M. Kinzer, Michael M. Dube, Oseob Jeon +2 more | 2016-10-25 |
| 9177925 | Apparatus related to an improved package including a semiconductor die | Ahmad Ashrafzadeh, Justin Chiang, Daniel M. Kinzer, Michael M. Dube, Oseob Jeon +2 more | 2015-11-03 |