Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400933 | Jet impingement heatsink for high power semiconductor devices | Changsun YUN | 2025-08-26 |
| 12368085 | Integration of semiconductor device assemblies with thermal dissipation mechanisms | Seungwon IM, Dongwook Kang | 2025-07-22 |
| 12315826 | Semiconductor device package assemblies with direct leadframe attachment | Seungwon IM | 2025-05-27 |
| 12272615 | Thermal mismatch reduction in semiconductor device modules | Seungwon IM | 2025-04-08 |
| 12266590 | Dual side direct cooling semiconductor package | Inpil Yoo, Jerome Teysseyre, Keunhyuk LEE, Michael J. Seddon | 2025-04-01 |
| 12230551 | Immersion direct cooling modules | Youngsun KO, Seungwon IM, Jerome Teysseyre, Michael J. Seddon | 2025-02-18 |
| 12230606 | Semiconductor package and related methods | Seungwon IM, Joonseo SON, Mankyo Jong, Olaf Zschieschang | 2025-02-18 |
| 12230601 | High power module package structures | Seungwon IM, Jooyang EOM, Inpil Yoo | 2025-02-18 |
| 11967540 | Integrated circuit direct cooling systems having substrates in contact with a cooling medium | Seungwon IM, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2024-04-23 |
| 11961782 | Integration of semiconductor device assemblies with thermal dissipation mechanisms | Seungwon IM, Dongwook Kang | 2024-04-16 |
| 11901309 | Semiconductor device package assemblies with direct leadframe attachment | Seungwon IM | 2024-02-13 |
| 11615967 | Power module package and method of manufacturing the same | Keunhyuk LEE, Joonseo SON, Seungwon IM | 2023-03-28 |
| 11521921 | Semiconductor device package assemblies and methods of manufacture | Seungwon IM, Jeungdae KIM | 2022-12-06 |
| 11201105 | Semiconductor package having a spacer with a junction cooling pipe | Seungwon IM, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2021-12-14 |
| 11101198 | Semiconductor die package including a one-body clip | Seungwon IM, Joonseo SON | 2021-08-24 |
| 11037907 | Semiconductor package and related methods | Seungwon IM, Joonseo SON, Mankyo Jong, Olaf Zschieschang | 2021-06-15 |
| 11031379 | Stray inductance reduction in packaged semiconductor devices | Seungwon IM, Byoungok LEE | 2021-06-08 |
| 11004698 | Power module package | Keunhyuk LEE, Joon-seo Son, Seungwon IM | 2021-05-11 |
| 10607919 | Semiconductor package having junction cooling pipes embedded in substrates | Seungwon IM, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2020-03-31 |
| 10403601 | Semiconductor package and related methods | Seungwon IM, Joonseo SON, Mankyo Jong, Olaf Zschieschang | 2019-09-03 |
| 10090279 | Stray inductance reduction in packaged semiconductor devices and modules | Seungwon IM, Mankyo Jong, Byoungok LEE, Joonseo SON | 2018-10-02 |
| 9478519 | Package including a semiconductor die and a capacitive component | Ahmad Ashrafzadeh, Vijay Ullal, Justin Chiang, Daniel M. Kinzer, Michael M. Dube +2 more | 2016-10-25 |
| 9177925 | Apparatus related to an improved package including a semiconductor die | Ahmad Ashrafzadeh, Vijay Ullal, Justin Chiang, Daniel M. Kinzer, Michael M. Dube +2 more | 2015-11-03 |
| 9159656 | Semiconductor die package and method for making the same | Yoonhwa Choi, Boon Huan Gooi, Maria Cristina Estacio, David Chong, Tan Teik Keng +6 more | 2015-10-13 |
| 8890310 | Power module package having excellent heat sink emission capability and method for manufacturing the same | Keunhyuk LEE, Seungwon Lim | 2014-11-18 |