Issued Patents All Time
Showing 25 most recent of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1095474 | Power module package | Seungwon IM, Jeonghyuk Park, Keunhyuk LEE, Paolo BILARDO | 2025-09-30 |
| 12417999 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Maria Cristina Estacio, Seungwon IM, Jooyang EOM | 2025-09-16 |
| 12308364 | Power module package for direct cooling multiple power modules | Inpil Yoo, Jooyang EOM | 2025-05-20 |
| 12293955 | High power module package structures | Yusheng LIN | 2025-05-06 |
| 12266590 | Dual side direct cooling semiconductor package | Inpil Yoo, Oseob Jeon, Keunhyuk LEE, Michael J. Seddon | 2025-04-01 |
| 12230551 | Immersion direct cooling modules | Oseob Jeon, Youngsun KO, Seungwon IM, Michael J. Seddon | 2025-02-18 |
| 12205918 | Submodule semiconductor package | Jooyang EOM, Seungwon IM, Maria Cristina Estacio, Inpil Yoo | 2025-01-21 |
| 12142551 | Package including multiple semiconductor devices | Maria Cristina Estacio, Seungwon IM | 2024-11-12 |
| 12087677 | Molded packaging for wide band gap semiconductor devices | Maria Clemens Y. Quinones, Bigildis Dosdos, Erwin Ian V. Almagro, Romel N. Manatad | 2024-09-10 |
| 12074160 | Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads | Tiburcio A. Maldo, Keunhyuk LEE | 2024-08-27 |
| 11988743 | Molded proximity sensor | Jing-En Luan | 2024-05-21 |
| 11984424 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Maria Cristina Estacio, Seungwon IM, Jooyang EOM | 2024-05-14 |
| 11935817 | Power device module with dummy pad die layout | Yusheng LIN, Huibin Chen | 2024-03-19 |
| 11908826 | Flexible clip with aligner structure | Keunhyuk LEE, Tiburcio A. Maldo | 2024-02-20 |
| 11848320 | Power module package for direct cooling multiple power modules | Inpil Yoo, Jooyang EOM | 2023-12-19 |
| 11810775 | High power module package structures | Yusheng LIN | 2023-11-07 |
| 11735508 | Vertical and horizontal circuit assemblies | Romel N. Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian V. Almagro, Maria Cristina Estacio | 2023-08-22 |
| 11621203 | SiC MOSFET semiconductor packages and related methods | Maria Cristina Estacio, Elsie Agdon Cabahug | 2023-04-04 |
| 11616006 | Semiconductor package with heatsink | Maria Clemens Y. Quinones, Elsie Agdon Cabahug | 2023-03-28 |
| 11610832 | Heat transfer for power modules | Roveendra PAUL, Dukyong LEE | 2023-03-21 |
| 11545421 | Package including multiple semiconductor devices | Maria Cristina Estacio, Seungwon IM | 2023-01-03 |
| 11513220 | Molded proximity sensor | Jing-En Luan | 2022-11-29 |
| 11430777 | Power module package for direct cooling multiple power modules | Inpil Yoo, Jooyang EOM | 2022-08-30 |
| 11296069 | Substrate interposer on a leaderframe | Elsie Agdon Cabahug, Marie Clemens Ypil Quinones, Maria Cristina Estacio, Romel N. Manatad, Chung-Lin Wu | 2022-04-05 |
| 11264311 | Clips for semiconductor package and related methods | Inpil Yoo, Seungwon IM, Jooyang EOM | 2022-03-01 |