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Bigildis Dosdos

FS Fairchild Semiconductor: 9 patents #72 of 715Top 15%
ON onsemi: 4 patents #398 of 1,901Top 25%
Overall (All Time): #370,138 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12087677 Molded packaging for wide band gap semiconductor devices Maria Clemens Y. Quinones, Jerome Teysseyre, Erwin Ian V. Almagro, Romel N. Manatad 2024-09-10
11735508 Vertical and horizontal circuit assemblies Jerome Teysseyre, Romel N. Manatad, Chung-Lin Wu, Erwin Ian V. Almagro, Maria Cristina Estacio 2023-08-22
11177203 Vertical and horizontal circuit assemblies Jerome Teysseyre, Romel N. Manatad, Chung-Lin Wu, Erwin Ian V. Almagro, Maria Cristina Estacio 2021-11-16
11075148 Stacked transistor assembly with dual middle mounting clips Jeffrey P. Gambino, David T. Price, Jeffery A. Neuls, Dean E. Probst, Santosh Menon +1 more 2021-07-27
11004777 Semiconductor device assemblies Jerome Teysseyre, Chung-Lin Wu 2021-05-11
10256178 Vertical and horizontal circuit assemblies Jerome Teysseyre, Romel N. Manatad, Chung-Lin Wu, Erwin Ian V. Almagro, Maria Cristina Estacio 2019-04-09
9379045 Common drain power clip for battery pack protection mosfet Chung-Lin Wu, Steven Sapp, Suresh Belani, Sunggeun Yoon 2016-06-28
8723300 Multi-chip module power clip Chung-Lin Wu, Steven Sapp, Suresh Belani, Sunggeun Yoon 2014-05-13
8487371 Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the same Daniel M. Kinzer, Steven Sapp, Chung-Lin Wu, Oseob Jeon 2013-07-16
8193043 High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same Oseob Jeon, Chung-Lin Wu, Eddy Tjhia 2012-06-05
8003447 Multi-chip module for battery power control Jeongil Lee, Myoungho Lee, Charles Suico, Edwin Lee, David Chong Sook Lim +1 more 2011-08-23
7868432 Multi-chip module for battery power control Jeongil Lee, Myoungho Lee, Charles Suico, Lee Man Fai Edwin, David Chong Sook Lim +1 more 2011-01-11
7800219 High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same Oseob Jeon, Chung-Lin Wu, Eddy Tjhia 2010-09-21