Issued Patents All Time
Showing 1–25 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417999 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Jerome Teysseyre, Seungwon IM, Jooyang EOM | 2025-09-16 |
| 12300583 | Concealed gate terminal semiconductor packages and related methods | Erwin Ian V. Almagro, Maria Clemens Y. Quinones, Romel N. Manatad, Elsie Agdon Cabahug | 2025-05-13 |
| 12278169 | Electronic device packaging with galvanic isolation | Marlon Bartolo, Maria Clemens Y. Quinones, Chung-Lin Wu | 2025-04-15 |
| 12205918 | Submodule semiconductor package | Jooyang EOM, Seungwon IM, Jerome Teysseyre, Inpil Yoo | 2025-01-21 |
| 12142551 | Package including multiple semiconductor devices | Jerome Teysseyre, Seungwon IM | 2024-11-12 |
| 12051635 | Semiconductor device package with clip interconnect and dual side cooling | Elsie Agdon Cabahug, Romel N. Manatad | 2024-07-30 |
| 11984424 | Semiconductor packages using package in package systems and related methods | Inpil Yoo, Jerome Teysseyre, Seungwon IM, Jooyang EOM | 2024-05-14 |
| 11791247 | Concealed gate terminal semiconductor packages and related methods | Erwin Ian V. Almagro, Maria Clemens Y. Quinones, Romel N. Manatad, Elsie Agdon Cabahug | 2023-10-17 |
| 11735508 | Vertical and horizontal circuit assemblies | Jerome Teysseyre, Romel N. Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian V. Almagro | 2023-08-22 |
| 11621203 | SiC MOSFET semiconductor packages and related methods | Jerome Teysseyre, Elsie Agdon Cabahug | 2023-04-04 |
| 11545421 | Package including multiple semiconductor devices | Jerome Teysseyre, Seungwon IM | 2023-01-03 |
| 11296069 | Substrate interposer on a leaderframe | Elsie Agdon Cabahug, Marie Clemens Ypil Quinones, Romel N. Manatad, Chung-Lin Wu, Jerome Teysseyre | 2022-04-05 |
| 11177203 | Vertical and horizontal circuit assemblies | Jerome Teysseyre, Romel N. Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian V. Almagro | 2021-11-16 |
| 11088046 | Semiconductor device package with clip interconnect and dual side cooling | Elsie Agdon Cabahug, Romel N. Manatad | 2021-08-10 |
| 10943855 | Electronic device packaging with galvanic isolation | Marlon Bartolo, Maria Clemens Y. Quinones, Chung-Lin Wu | 2021-03-09 |
| 10910297 | Package including multiple semiconductor devices | Jerome Teysseyre, Seungwon IM | 2021-02-02 |
| 10546847 | Substrate interposer on a leadframe | Elsie Agdon Cabahug, Marie Clemens Ypil Quinones, Romel N. Manatad, Chung-Lin Wu, Jerome Teysseyre | 2020-01-28 |
| 10319670 | Package including multiple semiconductor devices | Jerome Teysseyre, Seungwon IM | 2019-06-11 |
| 10256178 | Vertical and horizontal circuit assemblies | Jerome Teysseyre, Romel N. Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian V. Almagro | 2019-04-09 |
| 9685398 | Thin semiconductor device packages | Margie T. Rios, Aira Lourdes Villamor, Armand Vincent C. Jereza | 2017-06-20 |
| 9583454 | Semiconductor die package including low stress configuration | Maria Clemens Y. Quinones | 2017-02-28 |
| 9536800 | Packaged semiconductor devices and methods of manufacturing | Ahmad Ashrafzadeh, Adrian Mikolajczak, Chung-Lin Wu | 2017-01-03 |
| 9478519 | Package including a semiconductor die and a capacitive component | Ahmad Ashrafzadeh, Vijay Ullal, Justin Chiang, Daniel M. Kinzer, Michael M. Dube +2 more | 2016-10-25 |
| 9177925 | Apparatus related to an improved package including a semiconductor die | Ahmad Ashrafzadeh, Vijay Ullal, Justin Chiang, Daniel M. Kinzer, Michael M. Dube +2 more | 2015-11-03 |
| 9159656 | Semiconductor die package and method for making the same | Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, David Chong, Tan Teik Keng +6 more | 2015-10-13 |