Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10535589 | Clip structure and semiconductor package using the same | Yun Hwa CHOI | 2020-01-14 |
| 9685398 | Thin semiconductor device packages | Margie T. Rios, Aira Lourdes Villamor, Maria Cristina Estacio | 2017-06-20 |
| 8497164 | Semiconductor die package and method for making the same | Paul Armand Asentista Calo, Erwin Victor Cruz | 2013-07-30 |
| 8222718 | Semiconductor die package and method for making the same | Paul Armand Asentista Calo, Erwin Victor Cruz | 2012-07-17 |
| 8188587 | Semiconductor die package including lead with end portion | — | 2012-05-29 |
| 7898067 | Pre-molded, clip-bonded multi-die semiconductor package | — | 2011-03-01 |
| 7816784 | Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same | Joon-seo Son, Romel N. Manatad | 2010-10-19 |
| 7371616 | Clipless and wireless semiconductor die package and method for making the same | — | 2008-05-13 |