Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218038 | Leadframe, semiconductor package and method | Chau Fatt Chiang, Kok Yau Chua, Josef Hoeglauer, Swee Kah Lee, Khay Chwan Saw | 2025-02-04 |
| 12132017 | Method of soldering a semiconductor chip to a chip carrier | Michael Stadler | 2024-10-29 |
| 12094807 | Stacked transistor chip package with source coupling | Sergey Yuferev, Theng Chao Long, Josef Maerz, Chee Yang Ng, Petteri Palm +1 more | 2024-09-17 |
| 11830835 | Chip with chip pad and associated solder flux outgassing trench | Michael Stadler | 2023-11-28 |
| 11355429 | Electrical interconnect structure with radial spokes for improved solder void control | Tek Keong Gan, Ser Yee Keh, Tien Heng Lem, Fong Lim, Michael Stadler +1 more | 2022-06-07 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye, Chee Hong Lee +4 more | 2022-03-15 |
| 11211356 | Power semiconductor package and method for fabricating a power semiconductor package | Wee Aun Jason Lim, Ting Soon Chin, Chooi Mei Chong, Sanjay Kumar Murugan, Ying Pok Sam +1 more | 2021-12-28 |
| 9640459 | Semiconductor device including a solder barrier | Wee Boon Tay, Kuan Ching Woo | 2017-05-02 |
| 8497164 | Semiconductor die package and method for making the same | Armand Vincent C. Jereza, Erwin Victor Cruz | 2013-07-30 |
| 8222718 | Semiconductor die package and method for making the same | Armand Vincent C. Jereza, Erwin Victor Cruz | 2012-07-17 |
| 8110492 | Method for connecting a die attach pad to a lead frame and product thereof | Erwin Ian V. Almagro, Honorio T. Granada, Jr. | 2012-02-07 |
| 7800207 | Method for connecting a die attach pad to a lead frame and product thereof | Erwin Ian V. Almagro, Honorio T. Granada, Jr. | 2010-09-21 |
| 7586179 | Wireless semiconductor package for efficient heat dissipation | Margie T. Rios, Tiburcio A. Maldo, Joonseo SON, Erwin Ian V. Almagro | 2009-09-08 |
| 7402462 | Folded frame carrier for MOSFET BGA | Ruben Madrid, Marvin Gestole, Erwin Victor Cruz, Romel N. Madatad, Arniel Jaud | 2008-07-22 |