| 8372690 |
SiP substrate |
Maria Clemens Y. Quinones |
2013-02-12 |
| 8193618 |
Semiconductor die package with clip interconnection |
— |
2012-06-05 |
| 8193622 |
Thermally enhanced thin semiconductor package |
— |
2012-06-05 |
| 7893548 |
SiP substrate |
Maria Clemens Y. Quinones |
2011-02-22 |
| 7821116 |
Semiconductor die package including leadframe with die attach pad with folded edge |
— |
2010-10-26 |
| 7816178 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing |
Romel N. Manatad |
2010-10-19 |
| 7663211 |
Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture |
Jonathan Almeria Noquil |
2010-02-16 |
| 7576429 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing |
Romel N. Manatad |
2009-08-18 |
| 7402462 |
Folded frame carrier for MOSFET BGA |
Marvin Gestole, Erwin Victor Cruz, Romel N. Madatad, Arniel Jaud, Paul Armand Asentista Calo |
2008-07-22 |
| 7023077 |
Carrier with metal bumps for semiconductor die packages |
— |
2006-04-04 |
| 7002240 |
Semiconductor leadframe for staggered board attach |
— |
2006-02-21 |
| 6893901 |
Carrier with metal bumps for semiconductor die packages |
— |
2005-05-17 |
| 6861286 |
Method for making power chip scale package |
Maria Cristina Estacio |
2005-03-01 |
| 6857459 |
Wirefilm bonding for electronic component interconnection |
— |
2005-02-22 |
| 6777800 |
Semiconductor die package including drain clip |
Maria Clemens Y. Quinones |
2004-08-17 |
| 6707135 |
Semiconductor leadframe for staggered board attach |
— |
2004-03-16 |
| 6646329 |
Power chip scale package |
Maria Cristina Estacio |
2003-11-11 |
| 6006981 |
Wirefilm bonding for electronic component interconnection |
— |
1999-12-28 |