Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300583 | Concealed gate terminal semiconductor packages and related methods | Erwin Ian V. Almagro, Romel N. Manatad, Maria Cristina Estacio, Elsie Agdon Cabahug | 2025-05-13 |
| 12278169 | Electronic device packaging with galvanic isolation | Maria Cristina Estacio, Marlon Bartolo, Chung-Lin Wu | 2025-04-15 |
| 12087677 | Molded packaging for wide band gap semiconductor devices | Bigildis Dosdos, Jerome Teysseyre, Erwin Ian V. Almagro, Romel N. Manatad | 2024-09-10 |
| 11791247 | Concealed gate terminal semiconductor packages and related methods | Erwin Ian V. Almagro, Romel N. Manatad, Maria Cristina Estacio, Elsie Agdon Cabahug | 2023-10-17 |
| 11616006 | Semiconductor package with heatsink | Elsie Agdon Cabahug, Jerome Teysseyre | 2023-03-28 |
| 10943855 | Electronic device packaging with galvanic isolation | Maria Cristina Estacio, Marlon Bartolo, Chung-Lin Wu | 2021-03-09 |
| 10446498 | Isolation between semiconductor components | John Constantino, Timwah Luk, Ahmad Ashrafzadeh, Robert L. Krause, Etan Shacham +2 more | 2019-10-15 |
| 9735112 | Isolation between semiconductor components | John Constantino, Timwah Luk, Ahmad Ashrafzadeh, Robert L. Krause, Etan Shacham +2 more | 2017-08-15 |
| 9583454 | Semiconductor die package including low stress configuration | Maria Cristina Estacio | 2017-02-28 |
| 8372690 | SiP substrate | Ruben Madrid | 2013-02-12 |
| 8106501 | Semiconductor die package including low stress configuration | Maria Cristina Estacio | 2012-01-31 |
| 7893548 | SiP substrate | Ruben Madrid | 2011-02-22 |
| 7824966 | Flex chip connector for semiconductor device | Jocel P. Gomez | 2010-11-02 |
| 7659531 | Optical coupler package | Yoon-hwa Choi, Yong-suk Kwon | 2010-02-09 |
| 7626249 | Flex clip connector for semiconductor device | Jocel P. Gomez | 2009-12-01 |
| 7196313 | Surface mount multi-channel optocoupler | Rajeev Joshi | 2007-03-27 |
| 7052938 | Flip clip attach and copper clip attach on MOSFET device | Maria Cristina Estacio | 2006-05-30 |
| 6989588 | Semiconductor device including molded wireless exposed drain packaging | Consuelo Tangpuz | 2006-01-24 |
| 6870254 | Flip clip attach and copper clip attach on MOSFET device | Maria Cristina Estacio | 2005-03-22 |
| 6777800 | Semiconductor die package including drain clip | Ruben Madrid | 2004-08-17 |
| 6762067 | Method of packaging a plurality of devices utilizing a plurality of lead frames coupled together by rails | Gilmore S. Baje, Maria Christina B. Estacio, Marvin Gestole, Oliver M. Ledon, Santos E. Mepieza | 2004-07-13 |