Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8119457 | Flip chip MLP with folded heat sink | Jonathan Almeria Noquil, Yong Liu | 2012-02-21 |
| 8067273 | Self locking and aligning clip structure for semiconductor die package | — | 2011-11-29 |
| 7902657 | Self locking and aligning clip structure for semiconductor die package | — | 2011-03-08 |
| 7824966 | Flex chip connector for semiconductor device | Maria Clemens Y. Quinones | 2010-11-02 |
| 7737548 | Semiconductor die package including heat sinks | — | 2010-06-15 |
| 7626249 | Flex clip connector for semiconductor device | Maria Clemens Y. Quinones | 2009-12-01 |