Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932171 | Dual metal stud bumping for flip chip applications | Rajeev Joshi, Margie T. Rios, Erwin Victor Cruz | 2011-04-26 |
| 7842555 | Integrated transistor module and method of fabricating same | Rajeev Joshi, Jonathan Almeria Noquil | 2010-11-30 |
| 7682877 | Substrate based unmolded package | Rajeev Joshi, Jonathan Almeria Noquil | 2010-03-23 |
| 7582956 | Flip chip in leaded molded package and method of manufacture thereof | Rajeev Joshi, Romel N. Manatad | 2009-09-01 |
| 7501337 | Dual metal stud bumping for flip chip applications | Rajeev Joshi, Margie T. Rios, Erwin Victor Cruz | 2009-03-10 |
| 7501702 | Integrated transistor module and method of fabricating same | Rajeev Joshi, Jonathan Almeria Noquil | 2009-03-10 |
| 7439613 | Substrate based unmolded package | Rajeev Joshi, Jonathan Almeria Noquil | 2008-10-21 |
| 7271497 | Dual metal stud bumping for flip chip applications | Rajeev Joshi, Margie T. Rios, Erwin Victor Cruz | 2007-09-18 |
| 7215011 | Flip chip in leaded molded package and method of manufacture thereof | Rajeev Joshi, Romel N. Manatad | 2007-05-08 |
| 7154168 | Flip chip in leaded molded package and method of manufacture thereof | Rajeev Joshi, Romel N. Manatad | 2006-12-26 |
| 6989588 | Semiconductor device including molded wireless exposed drain packaging | Maria Clemens Y. Quinones | 2006-01-24 |
| 6949410 | Flip chip in leaded molded package and method of manufacture thereof | Rajeev Joshi, Romel N. Manatad | 2005-09-27 |
| 6943434 | Method for maintaining solder thickness in flipchip attach packaging processes | Romel N. Manatad, Margie T. Rios, Erwin Victor Cruz | 2005-09-13 |
| 6731003 | Wafer-level coated copper stud bumps | Rajeev Joshi, Erwin Victor Cruz | 2004-05-04 |
| 6720642 | Flip chip in leaded molded package and method of manufacture thereof | Rajeev Joshi, Romel N. Manatad | 2004-04-13 |
| 6423623 | Low Resistance package for semiconductor devices | Izak Bencuya, Maria Christina B. Estacio, Steven Sapp, Gilmore S. Baje, Rey D. Maligro | 2002-07-23 |
| 6391687 | Column ball grid array package | Elsie Agdon Cabahug | 2002-05-21 |