Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9685398 | Thin semiconductor device packages | Aira Lourdes Villamor, Maria Cristina Estacio, Armand Vincent C. Jereza | 2017-06-20 |
| 8426953 | Semiconductor package with an embedded printed circuit board and stacked die | Yong Liu, Hua Yang, Yumin Liu, Tiburcio A. Maldo | 2013-04-23 |
| 8088645 | 3D smart power module | Yong Liu, Yumin Liu, Hua Yang, Tiburcio A. Maldo | 2012-01-03 |
| 8063472 | Semiconductor package with stacked dice for a buck converter | Yong Liu, William Robert Newberry, Qiuxiao Qian | 2011-11-22 |
| 8030743 | Semiconductor package with an embedded printed circuit board and stacked die | Yong Liu, Hua Yang, Yumin Liu, Tiburcio A. Maldo | 2011-10-04 |
| 7932171 | Dual metal stud bumping for flip chip applications | Rajeev Joshi, Consuelo Tangpuz, Erwin Victor Cruz | 2011-04-26 |
| 7808101 | 3D smart power module | Yong Liu, Yumin Liu, Hua Yang, Tiburcio A. Maldo | 2010-10-05 |
| 7586179 | Wireless semiconductor package for efficient heat dissipation | Paul Armand Asentista Calo, Tiburcio A. Maldo, Joonseo SON, Erwin Ian V. Almagro | 2009-09-08 |
| 7501337 | Dual metal stud bumping for flip chip applications | Rajeev Joshi, Consuelo Tangpuz, Erwin Victor Cruz | 2009-03-10 |
| 7271497 | Dual metal stud bumping for flip chip applications | Rajeev Joshi, Consuelo Tangpuz, Erwin Victor Cruz | 2007-09-18 |
| 6943434 | Method for maintaining solder thickness in flipchip attach packaging processes | Consuelo Tangpuz, Romel N. Manatad, Erwin Victor Cruz | 2005-09-13 |