Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12284793 | Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices | Ritu Bawa, Ruander Cardenas, Kathiravan D, Jia Yan Go, Chin Kung GOH +31 more | 2025-04-22 |
| 12207435 | Cooling fan assembly with air guider | Vic Hong Chia, Yongguo Chen, Yaotsan Tsai, Xin Mao | 2025-01-21 |
| 12167567 | Fan silencer module | Vic Hong Chia, Yongguo Chen, Yaotsan Tsai, Xin Mao | 2024-12-10 |
| 12156324 | Thermal Interface Material (TIM) filling structure for high warpage chips | Yongguo Chen, Yaotsan Tsai, Vic Hong Chia | 2024-11-26 |
| 11778725 | Thermal interface material (TIM) filling structure for high warpage chips | Yongguo Chen, Yaotsan Tsai, Vic Hong Chia | 2023-10-03 |
| 11778771 | Airflow control louver for bidirectional airflow cooling | Vic Hong Chia, Wei Qi, Yong Luo | 2023-10-03 |
| 11758689 | Vapor chamber embedded remote heatsink | Yaotsan Tsai, Yongguo Chen, Vic Hong Chia | 2023-09-12 |
| 11493709 | Heat sink for pluggable optical module with compressible thermal interface material | Yao Tsan Tsai, Yong Guo Chen | 2022-11-08 |
| 11465248 | System and method for removing components of a fluid cooling system during operation | Yaotsan Tsai, Yongguo Chen, Zefeng Zhang, Vic Hong Chia | 2022-10-11 |
| 11346746 | Testing apparatus for directional simulation of dynamic collision between deep-sea shell structure and seabed | Junwei Liu, Shengjie Rui, Congbo Zhu, Haojie Zhang | 2022-05-31 |
| 11082013 | Method of reducing memory effect of power amplifier | Ching-Shyang Maa, Chun-Hsien Peng, I-No Liao, Chen-Jui Hsu, Jen-Yang Liu | 2021-08-03 |
| 10653077 | Plant purification device and control method thereof | Yuxiang Zhang, Qingjun Liu, Jingming Qu | 2020-05-19 |
| 10313446 | System and method for fire ground entry control based on internet of things | Yang Liu, Chenglie Feng | 2019-06-04 |
| 8508025 | Folded leadframe multiple die package | Yong Liu, Tiburcio A. Maldo | 2013-08-13 |
| 8426953 | Semiconductor package with an embedded printed circuit board and stacked die | Yong Liu, Margie T. Rios, Yumin Liu, Tiburcio A. Maldo | 2013-04-23 |
| 8198710 | Folded leadframe multiple die package | Yong Liu, Tiburcio A. Maldo | 2012-06-12 |
| 8088645 | 3D smart power module | Yong Liu, Yumin Liu, Tiburcio A. Maldo, Margie T. Rios | 2012-01-03 |
| 8030743 | Semiconductor package with an embedded printed circuit board and stacked die | Yong Liu, Margie T. Rios, Yumin Liu, Tiburcio A. Maldo | 2011-10-04 |
| 7952204 | Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same | Yumin Liu, Yong Liu, Tiburcio A. Maldo | 2011-05-31 |
| 7902646 | Multiphase synchronous buck converter | Yong Liu, Tiburcio A. Maldo | 2011-03-08 |
| 7821114 | Multiphase synchronous buck converter | Yong Liu, Tiburcio A. Maldo | 2010-10-26 |
| 7808101 | 3D smart power module | Yong Liu, Yumin Liu, Tiburcio A. Maldo, Margie T. Rios | 2010-10-05 |
| 7696612 | Multiphase synchronous buck converter | Yong Liu, Tiburcio A. Maldo | 2010-04-13 |