| 12284793 |
Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices |
Ritu Bawa, Ruander Cardenas, Kathiravan D, Jia Yan Go, Chin Kung GOH +31 more |
2025-04-22 |
| 12207435 |
Cooling fan assembly with air guider |
Vic Hong Chia, Yongguo Chen, Yaotsan Tsai, Xin Mao |
2025-01-21 |
| 12167567 |
Fan silencer module |
Vic Hong Chia, Yongguo Chen, Yaotsan Tsai, Xin Mao |
2024-12-10 |
| 12156324 |
Thermal Interface Material (TIM) filling structure for high warpage chips |
Yongguo Chen, Yaotsan Tsai, Vic Hong Chia |
2024-11-26 |
| 11778725 |
Thermal interface material (TIM) filling structure for high warpage chips |
Yongguo Chen, Yaotsan Tsai, Vic Hong Chia |
2023-10-03 |
| 11778771 |
Airflow control louver for bidirectional airflow cooling |
Vic Hong Chia, Wei Qi, Yong Luo |
2023-10-03 |
| 11758689 |
Vapor chamber embedded remote heatsink |
Yaotsan Tsai, Yongguo Chen, Vic Hong Chia |
2023-09-12 |
| 11493709 |
Heat sink for pluggable optical module with compressible thermal interface material |
Yao Tsan Tsai, Yong Guo Chen |
2022-11-08 |
| 11465248 |
System and method for removing components of a fluid cooling system during operation |
Yaotsan Tsai, Yongguo Chen, Zefeng Zhang, Vic Hong Chia |
2022-10-11 |
| 11346746 |
Testing apparatus for directional simulation of dynamic collision between deep-sea shell structure and seabed |
Junwei Liu, Shengjie Rui, Congbo Zhu, Haojie Zhang |
2022-05-31 |
| 11082013 |
Method of reducing memory effect of power amplifier |
Ching-Shyang Maa, Chun-Hsien Peng, I-No Liao, Chen-Jui Hsu, Jen-Yang Liu |
2021-08-03 |
| 10653077 |
Plant purification device and control method thereof |
Yuxiang Zhang, Qingjun Liu, Jingming Qu |
2020-05-19 |
| 10313446 |
System and method for fire ground entry control based on internet of things |
Yang Liu, Chenglie Feng |
2019-06-04 |
| 8508025 |
Folded leadframe multiple die package |
Yong Liu, Tiburcio A. Maldo |
2013-08-13 |
| 8426953 |
Semiconductor package with an embedded printed circuit board and stacked die |
Yong Liu, Margie T. Rios, Yumin Liu, Tiburcio A. Maldo |
2013-04-23 |
| 8198710 |
Folded leadframe multiple die package |
Yong Liu, Tiburcio A. Maldo |
2012-06-12 |
| 8088645 |
3D smart power module |
Yong Liu, Yumin Liu, Tiburcio A. Maldo, Margie T. Rios |
2012-01-03 |
| 8030743 |
Semiconductor package with an embedded printed circuit board and stacked die |
Yong Liu, Margie T. Rios, Yumin Liu, Tiburcio A. Maldo |
2011-10-04 |
| 7952204 |
Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same |
Yumin Liu, Yong Liu, Tiburcio A. Maldo |
2011-05-31 |
| 7902646 |
Multiphase synchronous buck converter |
Yong Liu, Tiburcio A. Maldo |
2011-03-08 |
| 7821114 |
Multiphase synchronous buck converter |
Yong Liu, Tiburcio A. Maldo |
2010-10-26 |
| 7808101 |
3D smart power module |
Yong Liu, Yumin Liu, Tiburcio A. Maldo, Margie T. Rios |
2010-10-05 |
| 7696612 |
Multiphase synchronous buck converter |
Yong Liu, Tiburcio A. Maldo |
2010-04-13 |