Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12209596 | Configurable bi-directional airflow fan | Yongguo Chen, Peter Christopher McLean, Zahid Naveed Aziz, Harvey Yang | 2025-01-28 |
| 12213276 | Intelligent dynamic air baffle | Chejung Liu, Ravinandana Mysore Ramachandra Rao | 2025-01-28 |
| 12207435 | Cooling fan assembly with air guider | Yongguo Chen, Yaotsan Tsai, Hua Yang, Xin Mao | 2025-01-21 |
| 12167567 | Fan silencer module | Yongguo Chen, Yaotsan Tsai, Hua Yang, Xin Mao | 2024-12-10 |
| 12160979 | Compressible thermal link | Chejung Liu, Ravinandana Mysore Ramachandra Rao | 2024-12-03 |
| 12156324 | Thermal Interface Material (TIM) filling structure for high warpage chips | Yongguo Chen, Yaotsan Tsai, Hua Yang | 2024-11-26 |
| 12075588 | Ejector for field replaceable module | Wei Qi | 2024-08-27 |
| 12022639 | Induced air convection cooling for computing or networking devices | Chejung Liu | 2024-06-25 |
| 11778771 | Airflow control louver for bidirectional airflow cooling | Wei Qi, Yong Luo, Hua Yang | 2023-10-03 |
| 11778725 | Thermal interface material (TIM) filling structure for high warpage chips | Yongguo Chen, Yaotsan Tsai, Hua Yang | 2023-10-03 |
| 11758689 | Vapor chamber embedded remote heatsink | Yaotsan Tsai, Yongguo Chen, Hua Yang | 2023-09-12 |
| 11716836 | Electromagnetic compatibility gasket and vent | George Edward Curtis, John David Stallings | 2023-08-01 |
| 11586259 | Incorporating heat spreader to electronics enclosure for enhanced cooling | Joseph Jacques, John Scott Scheeler | 2023-02-21 |
| 11465248 | System and method for removing components of a fluid cooling system during operation | Yaotsan Tsai, Yongguo Chen, Zefeng Zhang, Hua Yang | 2022-10-11 |
| 11404350 | High impact resistant heat sink | Hong Huynh, Steven A. Hanssen, Robert Gregory Twiss | 2022-08-02 |
| 11184994 | Configurable line card flapper | Mandy Hin Lam, M. Baris Dogruoz | 2021-11-23 |
| 11140800 | Strip-based ventilation solution for electronic equipment | George Edward Curtis, Adriana del Pilar Rangel, Keith Frank Tharp, Alpesh Umakant Bhobe | 2021-10-05 |
| 11129311 | Electromagnetic compatibility gasket and vent | George Edward Curtis, John David Stallings | 2021-09-21 |
| 10912216 | Bidirectional installation module for modular electronic system | Edward John Kliewer, Amrik S. Bains, Khanh T. Ly | 2021-02-02 |
| 10903140 | Bi-directional heatsink dampening force system | Phil Slight | 2021-01-26 |
| 10881036 | Minimizing or alleviating stress in a surface of a sheet metal structure caused by addition of surface features to the structure | Perry L. Hayden, Sr., Paul Matthew Plummer | 2020-12-29 |
| 10734306 | High impact resistant heat sink | Hong Huynh, Steven A. Hanssen, Robert Gregory Twiss | 2020-08-04 |
| 10674620 | Removable module adapter for modular electronic system | Edward John Kliewer | 2020-06-02 |
| 10622279 | Heatsink mounting system with overhang damping | . Minawati, Phillip S. Ting | 2020-04-14 |
| 10285291 | Line card ejector with emergency release | Mandy Hin Lam, Keith Frank Tharp | 2019-05-07 |