Patents per Year
Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12238856 | Heat sink with adaptive curvature to mitigate thermal runaway for a circuit component | Paul Ton | 2025-02-25 | |
| 12207435 | Cooling fan assembly with air guider | Vic Hong Chia, Yongguo Chen, Hua Yang, Xin Mao | 2025-01-21 | |
| 12167567 | Fan silencer module | Vic Hong Chia, Yongguo Chen, Hua Yang, Xin Mao | 2024-12-10 | $54,133,000 |
| 12156324 | Thermal Interface Material (TIM) filling structure for high warpage chips | Yongguo Chen, Vic Hong Chia, Hua Yang | 2024-11-26 | $66,950,000 |
| 11778725 | Thermal interface material (TIM) filling structure for high warpage chips | Yongguo Chen, Vic Hong Chia, Hua Yang | 2023-10-03 | $29,116,000 |
| 11758689 | Vapor chamber embedded remote heatsink | Yongguo Chen, Hua Yang, Vic Hong Chia | 2023-09-12 | $45,547,000 |
| 11465248 | System and method for removing components of a fluid cooling system during operation | Yongguo Chen, Zefeng Zhang, Hua Yang, Vic Hong Chia | 2022-10-11 | $36,557,000 |