Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12284793 | Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices | Ritu Bawa, Ruander Cardenas, Kathiravan D, Chin Kung GOH, Jeff Ku +31 more | 2025-04-22 |
| 11133261 | Electronic device packaging | Eng Huat Goh, Min Suet Lim, Chee Kheong Yoon | 2021-09-28 |
| 11006514 | Three-dimensional decoupling integration within hole in motherboard | Min Suet Lim, Tin Poay Chuah, Seok Ling Lim, Howe Yin Loo | 2021-05-11 |
| 10856454 | Electromagnetic interference (EMI) shield for circuit card assembly (CCA) | Min Suet Lim, Yew San Lim, Tin Poay Chuah, Eng Huat Goh | 2020-12-01 |
| 10492299 | Electronic assembly that includes a substrate bridge | Eng Huat Goh, Hoay Tien Teoh, Jenny Shio Yin Ong | 2019-11-26 |
| 10163777 | Interconnects for semiconductor packages | Seok Ling Lim, Eng Huat Goh, Hoay Tien Teoh, Jenny Shio Yin Ong, Jiun Hann Sir +1 more | 2018-12-25 |