Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424779 | Flexible printed circuit board arrangement | Jeff Ku, Yew San Lim, Boon Ping Koh, Min Suet Lim | 2025-09-23 |
| 12406916 | Via plug capacitor | Santosh Gangal | 2025-09-02 |
| 12349276 | Co-planar interconnection mechanisms for circuit boards | Mooi Ling Chang, Eng Huat Goh, Min Suet Lim, Twan Sing Loo | 2025-07-01 |
| 12328816 | Asymmetrical laminated circuit boards for improved electrical performance | Jackson Chung Peng Kong, Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim | 2025-06-10 |
| 12309984 | Radiation shield and groove in support structure | Boon Ping Koh, Twan Sing Loo, Yew San Lim | 2025-05-20 |
| 12256487 | Hybrid boards with embedded planes | Jackson Chung Peng Kong, Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Chin Lee Kuan | 2025-03-18 |
| 12250800 | Radiation shield with zipper | Yew San Lim, Jeff Ku, Boon Ping Koh, Min Suet Lim | 2025-03-11 |
| 12218042 | Via plug resistor | Santosh Gangal | 2025-02-04 |
| 12156331 | Technologies for power tunnels on circuit boards | Khai Ern See, Jia Lin Liew, Chee How Lim, Yi How Ooi | 2024-11-26 |
| 12061502 | Expandable thermal solution for laptops | Jeff Ku, Howe Yin Loo, Chin Kung GOH, Yew San Lim, Cora Nien | 2024-08-13 |
| 12033953 | Electronic device and crosstalk mitigating substrate | Min Suet Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2024-07-09 |
| 11942412 | Interposer with flexible portion | Bok Eng Cheah, Jackson Chung Peng Kong, Min Suet Lim | 2024-03-26 |
| 11758662 | Three dimensional foldable substrate with vertical side interface | Bok Eng Cheah, Jackson Chung Peng Kong | 2023-09-12 |
| 11699664 | Wrappable EMI shields | Eng Huat Goh, Yew San Lim, Min Suet Lim | 2023-07-11 |
| 11696409 | Vertical embedded component in a printed circuit board blind hole | Min Suet Lim, Hoay Tien Teoh, Mooi Ling Chang, Chin Lee Kuan | 2023-07-04 |
| 11589460 | System in package dual connector | Min Suet Lim, Chee Chun Yee, Yew San Lim, Eng Huat Goh | 2023-02-21 |
| 11556157 | Diagonal printed circuit boards systems | Min Suet Lim, Chee Chun Yee, Yew San Lim, Jeff Ku | 2023-01-17 |
| 11521943 | Method of forming a capacitive loop substrate assembly | Jenny Shio Yin Ong, Chin Lee Kuan | 2022-12-06 |
| 11487326 | Elevated docking station for different mobile devices | Jeff Ku, Yew San Lim, Min Suet Lim, Chee Chun Yee | 2022-11-01 |
| 11481001 | System for dual displays | Chee Chun Yee, Yew San Lim, Min Suet Lim, Jeff Ku | 2022-10-25 |
| 11445608 | Chassis interconnect for an electronic device | Chee How Lim, Eng Huat Goh, Jon Sern Lim, Khai Ern See, Min Suet Lim +1 more | 2022-09-13 |
| 11375617 | Three dimensional foldable substrate with vertical side interface | Bok Eng Cheah, Jackson Chung Peng Kong | 2022-06-28 |
| 11355427 | Device, method and system for providing recessed interconnect structures of a substrate | Howe Yin Loo, Sujit Sharan, Ananth Prabhakumar | 2022-06-07 |
| 11343906 | Stacked scalable voltage regulator module for platform area miniaturization | Tai Loong Wong, Fern Nee Tan, Min Suet Lim, Siang Yeong Tan | 2022-05-24 |
| 11304299 | Board to board interconnect | Chee Ling Wong, Wil Choon Song, Khang Choong Yong, Eng Huat Goh, Mohd Muhaiyiddin Bin Abdullah | 2022-04-12 |