Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11355427 | Device, method and system for providing recessed interconnect structures of a substrate | Howe Yin Loo, Sujit Sharan, Tin Poay Chuah | 2022-06-07 | $12,864,000 |
| 11264338 | Integrated circuit package with through void guard trace | Krishna Srinivasan, Arnab Sarkar | 2022-03-01 | $16,941,000 |
| 8048819 | Cure catalyst, composition, electronic device and associated method | Slawomir Rubinsztajn, John R. Campbell, Ryan Christopher Mills, Sandeep Tonapi | 2011-11-01 | |
| 7279223 | Underfill composition and packaged solid state device | Slawomir Rubinsztajn, John R. Campbell, Sandeep Tonapi | 2007-10-09 | $50,041,000 |
| 7022410 | Combinations of resin compositions and methods of use thereof | Sandeep Tonapi, John R. Campbell, Ryan Christopher Mills, Slawomir Rubinsztajn | 2006-04-04 | $32,265,000 |