| 12500175 |
Integrated bridge frame for package substrate |
Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi |
2025-12-16 |
|
| 12328816 |
Asymmetrical laminated circuit boards for improved electrical performance |
Jackson Chung Peng Kong, Bok Eng Cheah, Tin Poay Chuah, Jenny Shio Yin Ong |
2025-06-10 |
|
| 12256487 |
Hybrid boards with embedded planes |
Jackson Chung Peng Kong, Bok Eng Cheah, Jenny Shio Yin Ong, Chin Lee Kuan, Tin Poay Chuah |
2025-03-18 |
|
| 12218064 |
Molded silicon interconnects in bridges for integrated-circuit packages |
Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi |
2025-02-04 |
|
| 12191281 |
Multi-chip package with recessed memory |
Bok Eng Cheah, Yang Liang Poh, Jenny Shio Yin Ong, Jackson Chung Peng Kong |
2025-01-07 |
|
| 12183722 |
Molded interconnects in bridges for integrated-circuit packages |
Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong |
2024-12-31 |
$16,542,000 |
| 12142570 |
Composite bridge die-to-die interconnects for integrated-circuit packages |
Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Ping Ping Ooi |
2024-11-12 |
$28,491,000 |
| 12002747 |
Integrated bridge for die-to-die interconnects |
Bok Eng Cheah, Jenny Shio Yin Ong, Kooi Chi Ooi, Jackson Chung Peng Kong |
2024-06-04 |
$24,500,000 |
| 11955431 |
Interposer structures and methods for 2.5D and 3D packaging |
Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Saravanan Sethuraman |
2024-04-09 |
$27,197,000 |
| 11887940 |
Integrated circuit packages with conductive element having cavities housing electrically connected embedded components |
Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong |
2024-01-30 |
$30,721,000 |
| 11676910 |
Embedded reference layers for semiconductor package substrates |
Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi |
2023-06-13 |
$22,204,000 |
| 11574877 |
Semiconductor miniaturization through component placement on stepped stiffener |
Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong |
2023-02-07 |
$11,877,000 |
| 11562954 |
Frame-array interconnects for integrated-circuit packages |
Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong |
2023-01-24 |
$19,543,000 |
| 11527485 |
Electrical shield for stacked heterogeneous device integration |
Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi |
2022-12-13 |
$11,573,000 |
| 11527467 |
Multi-chip package with extended frame |
Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Kooi Chi Ooi |
2022-12-13 |
$11,573,000 |
| 11527463 |
Hybrid ball grid array package for high speed interconnects |
Bok Eng Cheah, Jenny Shio Yin Ong, Kooi Chi Ooi, Jackson Chung Peng Kong |
2022-12-13 |
$11,573,000 |
| 11521932 |
Composite bridge die-to-die interconnects for integrated-circuit packages |
Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Ping Ping Ooi |
2022-12-06 |
$14,727,000 |
| 11508650 |
Interposer for hybrid interconnect geometry |
Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi |
2022-11-22 |
$12,862,000 |
| 11508660 |
Molded power delivery interconnect module for improved Imax and power integrity |
Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong |
2022-11-22 |
$12,862,000 |
| 11476198 |
Multi-level components for integrated-circuit packages |
Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Kok Keng Wan |
2022-10-18 |
$11,317,000 |
| 11462488 |
Substrate cores for warpage control |
Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong |
2022-10-04 |
$13,460,000 |
| 11430764 |
Overhang bridge interconnect |
Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi |
2022-08-30 |
$13,077,000 |
| 11367673 |
Semiconductor package with hybrid through-silicon-vias |
Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong |
2022-06-21 |
$17,814,000 |
| 11342289 |
Vertical power plane module for semiconductor packages |
Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi |
2022-05-24 |
$18,289,000 |
| 11289427 |
Multi-faceted integrated-circuit dice and packages |
Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong |
2022-03-29 |
$28,068,000 |
