Issued Patents All Time
Showing 25 most recent of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288740 | Semiconductor package with hybrid mold layers | Bok Eng Cheah, Chia-Chuan Wu, Jackson Chung Peng Kong | 2025-04-29 |
| 12218064 | Molded silicon interconnects in bridges for integrated-circuit packages | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong | 2025-02-04 |
| 12002747 | Integrated bridge for die-to-die interconnects | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong | 2024-06-04 |
| 11887917 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Yang Liang Poh | 2024-01-30 |
| 11837458 | Substrate with gradiated dielectric for reducing impedance mismatch | Jackson Chung Peng Kong, Bok Eng Cheah, Ping Ping Ooi | 2023-12-05 |
| 11798894 | Devices and methods for signal integrity protection technique | Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim | 2023-10-24 |
| 11710029 | Methods and apparatus to improve data training of a machine learning model using a field programmable gate array | Min Suet Lim, Denica N. Larsen, Lady Nataly Pinilla Pico, Divya Vijayaraghavan | 2023-07-25 |
| 11676910 | Embedded reference layers for semiconductor package substrates | Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2023-06-13 |
| 11584368 | Evaluating risk factors of proposed vehicle maneuvers using external and internal data | Naissa Conde, Casey Baron, Shekoufeh Qawami, Mengjie Yu | 2023-02-21 |
| 11586473 | Methods and apparatus for allocating a workload to an accelerator using machine learning | Divya Vijayaraghavan, Denica N. Larsen, Lady Nataly Pinilla Pico, Min Suet Lim | 2023-02-21 |
| 11545434 | Vertical die-to-die interconnects bridge | Bok Eng Cheah, Yang Liang Poh | 2023-01-03 |
| 11527485 | Electrical shield for stacked heterogeneous device integration | Seok Ling Lim, Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2022-12-13 |
| 11527463 | Hybrid ball grid array package for high speed interconnects | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong | 2022-12-13 |
| 11527467 | Multi-chip package with extended frame | Bok Eng Cheah, Seok Ling Lim, Jackson Chung Peng Kong, Jenny Shio Yin Ong | 2022-12-13 |
| 11508650 | Interposer for hybrid interconnect geometry | Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2022-11-22 |
| 11482481 | Semiconductor device and system | Bok Eng Cheah, Jackson Chung Peng Kong, Lee Fueng Yap, Chan Kim Lee | 2022-10-25 |
| 11430764 | Overhang bridge interconnect | Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2022-08-30 |
| 11355458 | Interconnect core | Jackson Chung Peng Kong, Bok Eng Cheah, Ping Ping Ooi | 2022-06-07 |
| 11342289 | Vertical power plane module for semiconductor packages | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim | 2022-05-24 |
| 11282780 | Integrated bridge for die-to-die interconnects | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong | 2022-03-22 |
| 11195801 | Embedded reference layers for semiconductor package substrates | Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2021-12-07 |
| 11164827 | Substrate with gradiated dielectric for reducing impedance mismatch | Jackson Chung Peng Kong, Bok Eng Cheah, Ping Ping Ooi | 2021-11-02 |
| 11049801 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Yang Liang Poh | 2021-06-29 |
| 11030012 | Methods and apparatus for allocating a workload to an accelerator using machine learning | Divya Vijayaraghavan, Denica N. Larsen, Lady Nataly Pinilla Pico, Min Suet Lim | 2021-06-08 |
| 10980108 | Multi-conductor interconnect structure for a microelectronic device | Ping Ping Ooi, Bok Eng Cheah, Jackson Chung Peng Kong | 2021-04-13 |