Issued Patents All Time
Showing 51–57 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8110930 | Die backside metallization and surface activated bonding for stacked die packages | Shanggar Periaman, Yen Hsiang Chew, Bok Eng Cheah | 2012-02-07 |
| 8044497 | Stacked die package | Bok Eng Cheah, Shanggar Periaman, Yen Hsiang Chew | 2011-10-25 |
| 7773504 | Bandwidth allocation for network packet traffic | Yen Hsiang Chew, Shanggar Periaman, Bok Eng Cheah | 2010-08-10 |
| 7743181 | Quality of service (QoS) processing of data packets | Yen Hsiang Chew, Shanggar Periaman, Bok Eng Cheah | 2010-06-22 |
| 7692278 | Stacked-die packages with silicon vias and surface activated bonding | Shanggar Periaman, Bok Eng Cheah | 2010-04-06 |
| 7400033 | Package on package design to improve functionality and efficiency | Bok Eng Cheah, Shanggar Periaman | 2008-07-15 |
| 7279795 | Stacked die semiconductor package | Shanggar Periaman | 2007-10-09 |