| 10403604 |
Stacked package assembly with voltage reference plane |
Bok Eng Cheah, Jackson Chung Peng Kong, Ping Ping Ooi, Kooi Chi Ooi |
2019-09-03 |
| 10396038 |
Flexible packaging architecture |
Bok Eng Cheah, Jackson Chung Peng Kong, Michael P. Skinner, Yen Hsiang Chew, Kheng Tat MAR +2 more |
2019-08-27 |
| 9812425 |
Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same |
Bok Eng Cheah, Kooi Chi Ooi, Jackson Chung Peng Kong |
2017-11-07 |
| 9778688 |
Flexible system-in-package solutions for wearable devices |
Jiamiao Tang, Junfeng Zhao, Michael P. Skinner, Yong She, Jiun Hann Sir +3 more |
2017-10-03 |
| 9721878 |
High density second level interconnection for bumpless build up layer (BBUL) packaging technology |
Bok Eng Cheah, Kooi Chi Ooi |
2017-08-01 |
| 9646953 |
Integrated circuit packaging techniques and configurations for small form-factor or wearable devices |
Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi, Michael P. Skinner |
2017-05-09 |
| 9478524 |
Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same |
Bok Eng Cheah, Kooi Chi Ooi, Jackson Chung Peng Kong |
2016-10-25 |
| 9136251 |
Method to enable controlled side chip interconnection for 3D integrated packaging system |
Bok Eng Cheah, Kooi Chi Ooi, Jackson Chung Peng Kong |
2015-09-15 |
| 8987896 |
High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same |
Bok Eng Cheah, Kooi Chi Ooi |
2015-03-24 |
| 8697495 |
Stacked die package |
Bok Eng Cheah, Kooi Chi Ooi, Yen Hsiang Chew |
2014-04-15 |
| 8281229 |
Firmware verification using system memory error check logic |
Yen Hsiang Chew, Bok Eng Cheah, Kooi Chi Ooi |
2012-10-02 |
| 8198716 |
Die backside wire bond technology for single or stacked die package |
Kooi Chi Ooi, Bok Eng Cheah, Yen Hsiang Chew |
2012-06-12 |
| 8110930 |
Die backside metallization and surface activated bonding for stacked die packages |
Kooi Chi Ooi, Yen Hsiang Chew, Bok Eng Cheah |
2012-02-07 |
| 8044497 |
Stacked die package |
Bok Eng Cheah, Kooi Chi Ooi, Yen Hsiang Chew |
2011-10-25 |
| 7773504 |
Bandwidth allocation for network packet traffic |
Yen Hsiang Chew, Kooi Chi Ooi, Bok Eng Cheah |
2010-08-10 |
| 7743181 |
Quality of service (QoS) processing of data packets |
Yen Hsiang Chew, Kooi Chi Ooi, Bok Eng Cheah |
2010-06-22 |
| 7692278 |
Stacked-die packages with silicon vias and surface activated bonding |
Kooi Chi Ooi, Bok Eng Cheah |
2010-04-06 |
| 7400033 |
Package on package design to improve functionality and efficiency |
Bok Eng Cheah, Kooi Chi Ooi |
2008-07-15 |
| 7279795 |
Stacked die semiconductor package |
Kooi Chi Ooi |
2007-10-09 |