| 12512360 |
Chip transfer method and electronic device |
Harold L. Long, SHIANG-HUI WEI, Jianbin Fang |
2025-12-30 |
|
| 12046581 |
Integrated circuit package with glass spacer |
Mao Guo, Hyoung Il Kim, Sireesha Gogineni |
2024-07-23 |
$20,446,000 |
| 12027496 |
Film in substrate for releasing z stack-up constraint |
Jianfeng Hu, Zhicheng Ding, Zhijun Xu |
2024-07-02 |
$27,114,000 |
| 11990395 |
Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement |
Xiaoying Tang, Zhicheng Ding, Bin Liu, Zhijun Xu |
2024-05-21 |
$18,840,000 |
| 11894344 |
Power enhanced stacked chip scale package solution with integrated die attach film |
Zhijun Xu, Bin Liu, Zhicheng Ding |
2024-02-06 |
$35,892,000 |
| 11881441 |
Stacked die semiconductor package spacer die |
Sireesha Gogineni, Andrew Tae Kim, Karissa J. Blue |
2024-01-23 |
$52,361,000 |
| 11848281 |
Die stack with reduced warpage |
Bin Liu, Zhicheng Ding, Aiping Tan |
2023-12-19 |
$50,836,000 |
| 11830848 |
Electronic device package |
Zhicheng Ding, Bin Liu, Hyoung Il Kim |
2023-11-28 |
$31,872,000 |
| 11742284 |
Interconnect structure fabricated using lithographic and deposition processes |
Zhicheng Ding, Bin Liu, Zhijun Xu |
2023-08-29 |
$19,273,000 |
| 11538746 |
Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same |
Zhicheng Ding, Bin Liu, Aiping Tan, Li Deng |
2022-12-27 |
$12,365,000 |
| 11393788 |
Integrated circuit package with glass spacer |
Mao Guo, Hyoung Il Kim, Sireesha Gogineni |
2022-07-19 |
$11,394,000 |
| 11302671 |
Power enhanced stacked chip scale package solution with integrated die attach film |
Zhijun Xu, Bin Liu, Zhicheng Ding |
2022-04-12 |
$16,909,000 |
| 11081451 |
Die stack with reduced warpage |
Bin Liu, Zhicheng Ding, Aiping Tan |
2021-08-03 |
$25,424,000 |
| 10991679 |
Stair-stacked dice device in a system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Aiping Tan, Li Deng |
2021-04-27 |
$44,593,000 |
| 10930622 |
Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Aiping Tan, Li Deng |
2021-02-23 |
$31,062,000 |
| 10910347 |
Method, apparatus and system to interconnect packaged integrated circuit dies |
John G. Meyers, Zhicheng Ding, Richard Patten |
2021-02-02 |
$28,243,000 |
| 10872832 |
Pre-molded active IC of passive components to miniaturize system in package |
Mao Guo, John G. Meyers, Bin Liu, Lingyan L. Tan |
2020-12-22 |
$47,741,000 |
| 10770434 |
Stair-stacked dice device in a system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Aiping Tan, Li Deng |
2020-09-08 |
$26,363,000 |
| 10727208 |
Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same |
Zhicheng Ding, Bin Liu, Aiping Tan, Li Deng |
2020-07-28 |
$26,273,000 |
| 10438916 |
Wire bond connection with intermediate contact structure |
— |
2019-10-08 |
$19,521,000 |
| 10396055 |
Method, apparatus and system to interconnect packaged integrated circuit dies |
John G. Meyers, Zhicheng Ding, Richard Patten |
2019-08-27 |
$17,353,000 |
| 10332899 |
3D package having edge-aligned die stack with direct inter-die wire connections |
Yi Xu, Florence R. Pon |
2019-06-25 |
$17,766,000 |
| 9859255 |
Electronic device package |
Jh Yoon, Mao Guo, Richard Patten |
2018-01-02 |
$11,729,000 |
| 9778688 |
Flexible system-in-package solutions for wearable devices |
Jiamiao Tang, Junfeng Zhao, Michael P. Skinner, Jiun Hann Sir, Bok Eng Cheah +3 more |
2017-10-03 |
$11,313,000 |
