Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347784 | Interposer with step feature | Yi Xu | 2025-07-01 |
| 12340077 | Computer-assisted or autonomous driving vehicles social network | Fatema Adenwala, Ankitha Chandran, Nageen Himayat, Divya Vijayaraghavan | 2025-06-24 |
| 12266591 | Choked flow cooling | Mark Forsnes, Yuhong Cai, Yi Xu | 2025-04-01 |
| 12068283 | Die stack with cascade and vertical connections | Min-Tih Lai, Yuhong Cai, John G. Meyers | 2024-08-20 |
| 11948917 | Die over mold stacked semiconductor package | Yi Xu, James Zhang, Yuhong Cai, Tyler Leuten, William T. Glennan +1 more | 2024-04-02 |
| 11901274 | Packaged integrated circuit device with recess structure | Bin Liu, John G. Meyers | 2024-02-13 |
| 11901264 | Choked flow cooling | Mark Forsnes, Yuhong Cai, Yi Xu | 2024-02-13 |
| 11749653 | Multi-die, vertical-wire package-in-package apparatus, and methods of making same | Hyoung Il Kim, Yi Xu | 2023-09-05 |
| 11704007 | Computer-assisted or autonomous driving vehicles social network | Fatema Adenwala, Ankitha Chandran, Nageen Himayat, Divya Vijayaraghavan | 2023-07-18 |
| 11658079 | Temporary interconnect for use in testing a semiconductor package | Hyoung Il Kim, Yi Xu | 2023-05-23 |
| 11652031 | Shrinkable package assembly | Yi Xu, Min-Tih Lai | 2023-05-16 |
| 11599750 | Edge devices utilizing personalized machine learning and methods of operating the same | Maruti Gupta Hyde, Naissa Conde, Xue Yang, Wei Yee Koay | 2023-03-07 |
| 11562978 | Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same | Tyler Leuten, John Yap | 2023-01-24 |
| 11552051 | Electronic device package | John G. Meyers | 2023-01-10 |
| 11545464 | Diode for use in testing semiconductor packages | Yi Xu, Hyoung Il Kim | 2023-01-03 |
| 11495547 | Fiber reinforced stiffener | Tyler Leuten, Maria Angela Damille Ramiso | 2022-11-08 |
| 11399434 | Electronic package and method of forming an electronic package | Tyler Leuten, Maria Angela Damille Ramiso | 2022-07-26 |
| 11171114 | Die stack with cascade and vertical connections | Min-Tih Lai, Yuhong Cai, John G. Meyers | 2021-11-09 |
| 11064612 | Buried electrical debug access port | Bilal Khalaf, Saeed S. Shojaie | 2021-07-13 |
| 11036370 | Computer-assisted or autonomous driving vehicles social network | Fatema Adenwala, Ankitha Chandran, Nageen Himayat, Divya Vijayaraghavan | 2021-06-15 |
| 10910301 | Post-grind die backside power delivery | Min-Tih Lai, Tyler Leuten | 2021-02-02 |
| 10573575 | Semiconductor package with thermal fins | Hyoung Il Kim, Yi Xu, Yuhong Cai, Min-Tih Lai, Leo Craft | 2020-02-25 |
| 10483198 | Post-grind die backside power delivery | Min-Tih Lai, Tyler Leuten | 2019-11-19 |
| 10332899 | 3D package having edge-aligned die stack with direct inter-die wire connections | Yi Xu, Yong She | 2019-06-25 |
| 10090261 | Microelectronic package debug access ports and methods of fabricating the same | Bilal Khalaf, Saeed S. Shojaie | 2018-10-02 |