| 12347784 |
Interposer with step feature |
Yi Xu |
2025-07-01 |
|
| 12340077 |
Computer-assisted or autonomous driving vehicles social network |
Fatema Adenwala, Ankitha Chandran, Nageen Himayat, Divya Vijayaraghavan |
2025-06-24 |
|
| 12266591 |
Choked flow cooling |
Mark Forsnes, Yuhong Cai, Yi Xu |
2025-04-01 |
|
| 12068283 |
Die stack with cascade and vertical connections |
Min-Tih Lai, Yuhong Cai, John G. Meyers |
2024-08-20 |
$20,163,000 |
| 11948917 |
Die over mold stacked semiconductor package |
Yi Xu, James Zhang, Yuhong Cai, Tyler Leuten, William T. Glennan +1 more |
2024-04-02 |
$34,819,000 |
| 11901264 |
Choked flow cooling |
Mark Forsnes, Yuhong Cai, Yi Xu |
2024-02-13 |
|
| 11901274 |
Packaged integrated circuit device with recess structure |
Bin Liu, John G. Meyers |
2024-02-13 |
$18,546,000 |
| 11749653 |
Multi-die, vertical-wire package-in-package apparatus, and methods of making same |
Hyoung Il Kim, Yi Xu |
2023-09-05 |
$19,899,000 |
| 11704007 |
Computer-assisted or autonomous driving vehicles social network |
Fatema Adenwala, Ankitha Chandran, Nageen Himayat, Divya Vijayaraghavan |
2023-07-18 |
$21,060,000 |
| 11658079 |
Temporary interconnect for use in testing a semiconductor package |
Hyoung Il Kim, Yi Xu |
2023-05-23 |
$11,397,000 |
| 11652031 |
Shrinkable package assembly |
Yi Xu, Min-Tih Lai |
2023-05-16 |
$11,130,000 |
| 11599750 |
Edge devices utilizing personalized machine learning and methods of operating the same |
Maruti Gupta Hyde, Naissa Conde, Xue Yang, Wei Yee Koay |
2023-03-07 |
$16,825,000 |
| 11562978 |
Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same |
Tyler Leuten, John Yap |
2023-01-24 |
$19,543,000 |
| 11552051 |
Electronic device package |
John G. Meyers |
2023-01-10 |
$14,061,000 |
| 11545464 |
Diode for use in testing semiconductor packages |
Yi Xu, Hyoung Il Kim |
2023-01-03 |
$15,575,000 |
| 11495547 |
Fiber reinforced stiffener |
Tyler Leuten, Maria Angela Damille Ramiso |
2022-11-08 |
$15,080,000 |
| 11399434 |
Electronic package and method of forming an electronic package |
Tyler Leuten, Maria Angela Damille Ramiso |
2022-07-26 |
$27,041,000 |
| 11171114 |
Die stack with cascade and vertical connections |
Min-Tih Lai, Yuhong Cai, John G. Meyers |
2021-11-09 |
$28,241,000 |
| 11064612 |
Buried electrical debug access port |
Bilal Khalaf, Saeed S. Shojaie |
2021-07-13 |
$34,958,000 |
| 11036370 |
Computer-assisted or autonomous driving vehicles social network |
Fatema Adenwala, Ankitha Chandran, Nageen Himayat, Divya Vijayaraghavan |
2021-06-15 |
$33,380,000 |
| 10910301 |
Post-grind die backside power delivery |
Min-Tih Lai, Tyler Leuten |
2021-02-02 |
$28,243,000 |
| 10573575 |
Semiconductor package with thermal fins |
Hyoung Il Kim, Yi Xu, Yuhong Cai, Min-Tih Lai, Leo Craft |
2020-02-25 |
$18,813,000 |
| 10483198 |
Post-grind die backside power delivery |
Min-Tih Lai, Tyler Leuten |
2019-11-19 |
$26,843,000 |
| 10332899 |
3D package having edge-aligned die stack with direct inter-die wire connections |
Yi Xu, Yong She |
2019-06-25 |
$17,766,000 |
| 10090261 |
Microelectronic package debug access ports and methods of fabricating the same |
Bilal Khalaf, Saeed S. Shojaie |
2018-10-02 |
$23,827,000 |
