Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10964682 | Data storage system using wafer-level packaging | John G. Meyers | 2021-03-30 | $32,599,000 |
| 10573575 | Semiconductor package with thermal fins | Hyoung Il Kim, Florence R. Pon, Yi Xu, Yuhong Cai, Min-Tih Lai | 2020-02-25 | $18,813,000 |
| 7750466 | Microelectronic assembly having second level interconnects including solder joints reinforced with crack arrester elements and method of forming same | Timothy Rothman, Dong W. Kim | 2010-07-06 | $9,424,000 |
| 6098283 | Method for filling vias in organic, multi-layer packages | Mike Goetsch, Jim Siettmann, Eric D. Swanger | 2000-08-08 | $246,908,000 |