JS

Jim Siettmann

IN Intel: 1 patents #18,218 of 30,777Top 60%
Overall (All Time): #3,622,866 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6098283 Method for filling vias in organic, multi-layer packages Mike Goetsch, Leo Craft, Eric D. Swanger 2000-08-08