Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046581 | Integrated circuit package with glass spacer | Mao Guo, Yong She, Sireesha Gogineni | 2024-07-23 |
| 11990449 | Dual RDL stacked die package using vertical wire | — | 2024-05-21 |
| 11948917 | Die over mold stacked semiconductor package | Florence R. Pon, Yi Xu, James Zhang, Yuhong Cai, Tyler Leuten +1 more | 2024-04-02 |
| 11830848 | Electronic device package | Zhicheng Ding, Bin Liu, Yong She | 2023-11-28 |
| 11817438 | System in package with interconnected modules | Bilal Khalaf, Juan E. Dominguez, John G. Meyers | 2023-11-14 |
| 11749653 | Multi-die, vertical-wire package-in-package apparatus, and methods of making same | Florence R. Pon, Yi Xu | 2023-09-05 |
| 11694987 | Active package substrate having anisotropic conductive layer | Juan E. Dominguez | 2023-07-04 |
| 11658079 | Temporary interconnect for use in testing a semiconductor package | Yi Xu, Florence R. Pon | 2023-05-23 |
| 11637045 | Anisotropic conductive film (ACF) for use in testing semiconductor packages | — | 2023-04-25 |
| 11545464 | Diode for use in testing semiconductor packages | Yi Xu, Florence R. Pon | 2023-01-03 |
| 11393788 | Integrated circuit package with glass spacer | Mao Guo, Yong She, Sireesha Gogineni | 2022-07-19 |
| 11251111 | Leadframe in packages of integrated circuits | — | 2022-02-15 |
| 11211314 | Interposer for electrically connecting stacked integrated circuit device packages | Yi Xu | 2021-12-28 |
| 11145632 | High density die package configuration on system boards | Juan E. Dominguez, Bilal Khalaf, John G. Meyers | 2021-10-12 |
| 10892248 | Multi-stacked die package with flexible interconnect | — | 2021-01-12 |
| 10863017 | Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal | Tae-Jun Park | 2020-12-08 |
| 10847450 | Compact wirebonding in stacked-chip system in package, and methods of making same | Saeed S. Shojaie, Bilal Khalaf, Min-Tih Lai | 2020-11-24 |
| 10790257 | Active package substrate having anisotropic conductive layer | Juan E. Dominguez | 2020-09-29 |
| 10777486 | Substrate-free system in package design | — | 2020-09-15 |
| 10727220 | Package on package with integrated passive electronics method and apparatus | — | 2020-07-28 |
| 10573575 | Semiconductor package with thermal fins | Florence R. Pon, Yi Xu, Yuhong Cai, Min-Tih Lai, Leo Craft | 2020-02-25 |
| 10497669 | Hybrid die stacking | Juan E. Dominguez | 2019-12-03 |
| 10446533 | Package on package with integrated passive electronics method and apparatus | — | 2019-10-15 |
| 10425524 | Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal | Tae-Jun Park | 2019-09-24 |
| 10393799 | Electronic device package | — | 2019-08-27 |