Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068283 | Die stack with cascade and vertical connections | Florence R. Pon, Yuhong Cai, John G. Meyers | 2024-08-20 |
| 12052206 | Systems and methods for improving interactions with artificial intelligence models | — | 2024-07-30 |
| 11652031 | Shrinkable package assembly | Florence R. Pon, Yi Xu | 2023-05-16 |
| 11171114 | Die stack with cascade and vertical connections | Florence R. Pon, Yuhong Cai, John G. Meyers | 2021-11-09 |
| 10910301 | Post-grind die backside power delivery | Tyler Leuten, Florence R. Pon | 2021-02-02 |
| 10872880 | Land grid array package extension | Tyler Leuten | 2020-12-22 |
| 10847450 | Compact wirebonding in stacked-chip system in package, and methods of making same | Saeed S. Shojaie, Hyoung Il Kim, Bilal Khalaf | 2020-11-24 |
| 10770429 | Microelectronic device stacks having interior window wirebonding | Cory A. Runyan | 2020-09-08 |
| 10748873 | Substrates, assembles, and techniques to enable multi-chip flip chip packages | Mao Guo, Tyler Leuten | 2020-08-18 |
| 10573575 | Semiconductor package with thermal fins | Hyoung Il Kim, Florence R. Pon, Yi Xu, Yuhong Cai, Leo Craft | 2020-02-25 |
| 10483198 | Post-grind die backside power delivery | Tyler Leuten, Florence R. Pon | 2019-11-19 |
| 10304799 | Land grid array package extension | Tyler Leuten | 2019-05-28 |
| 10122836 | Magnetic convection cooling for handheld device | — | 2018-11-06 |
| 10032707 | Post-grind die backside power delivery | Tyler Leuten, Florence R. Pon | 2018-07-24 |