Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11562955 | High density multiple die structure | — | 2023-01-24 | $19,543,000 |
| 10770429 | Microelectronic device stacks having interior window wirebonding | Min-Tih Lai | 2020-09-08 | $26,363,000 |
| 9917041 | 3D chip assemblies using stacked leadframes | Florence R. Pon | 2018-03-13 | $24,990,000 |
| 6075690 | Relay multiplexer system and method for improved debounce of relays | Robert W. Hormuth, Brian Mead Tyler, Scott B. Kovner | 2000-06-13 | $31,992,000 |