Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347784 | Interposer with step feature | Florence R. Pon | 2025-07-01 |
| 12266591 | Choked flow cooling | Mark Forsnes, Yuhong Cai, Florence R. Pon | 2025-04-01 |
| 12237300 | Through-substrate void filling for an integrated circuit assembly | Tyler Leuten, Eleanor Patricia Paras Rabadam | 2025-02-25 |
| 11948917 | Die over mold stacked semiconductor package | Florence R. Pon, James Zhang, Yuhong Cai, Tyler Leuten, William T. Glennan +1 more | 2024-04-02 |
| 11901264 | Choked flow cooling | Mark Forsnes, Yuhong Cai, Florence R. Pon | 2024-02-13 |
| 11894334 | Dual head capillary design for vertical wire bond | Yuhong Cai, Bilal Khalaf | 2024-02-06 |
| 11848292 | Pad design for thermal fatigue resistance and interconnect joint reliability | Sireesha Gogineni, Yuhong Cai | 2023-12-19 |
| 11749653 | Multi-die, vertical-wire package-in-package apparatus, and methods of making same | Hyoung Il Kim, Florence R. Pon | 2023-09-05 |
| 11710674 | Embedded component and methods of making the same | Bilal Khalaf, Dennis Sean Carr | 2023-07-25 |
| 11694976 | Bowl shaped pad | Yuhong Cai, Sireesha Gogineni | 2023-07-04 |
| 11658079 | Temporary interconnect for use in testing a semiconductor package | Hyoung Il Kim, Florence R. Pon | 2023-05-23 |
| 11652031 | Shrinkable package assembly | Florence R. Pon, Min-Tih Lai | 2023-05-16 |
| 11569144 | Semiconductor package design for solder joint reliability | Yuhong Cai | 2023-01-31 |
| 11566275 | Chromatin immunocapture devices and methods of use | Ryan C. Bailey, Joshua David Tice, Tamas Ordog, Jeong Heon Lee, Richard Martin Graybill +1 more | 2023-01-31 |
| 11545464 | Diode for use in testing semiconductor packages | Hyoung Il Kim, Florence R. Pon | 2023-01-03 |
| 11476174 | Solder mask design for delamination prevention | James Zhang, Yuhong Cai | 2022-10-18 |
| 11315843 | Embedded component and methods of making the same | Bilal Khalaf, Dennis Sean Carr | 2022-04-26 |
| 11211314 | Interposer for electrically connecting stacked integrated circuit device packages | Hyoung Il Kim | 2021-12-28 |
| 11056465 | Semiconductor package having singular wire bond on bonding pads | — | 2021-07-06 |
| 10879152 | Through mold via (TMV) using stacked modular mold rings | Bilal Khalaf | 2020-12-29 |
| 10597698 | Chromatin immunocapture devices and methods of use | Ryan C. Bailey, Joshua David Tice, Tamas Ordog, Jeong Heon Lee, Richard Martin Graybill +1 more | 2020-03-24 |
| 10573575 | Semiconductor package with thermal fins | Hyoung Il Kim, Florence R. Pon, Yuhong Cai, Min-Tih Lai, Leo Craft | 2020-02-25 |
| 10366934 | Face down dual sided chip scale memory package | Chan H. Yoo, Akshay N. Singh, Liana Foster, Steven Eskildsen | 2019-07-30 |
| 10332899 | 3D package having edge-aligned die stack with direct inter-die wire connections | Florence R. Pon, Yong She | 2019-06-25 |
| 10213782 | Microfluidic devices | Ryan C. Bailey, Steven Doonan | 2019-02-26 |