| 12347784 |
Interposer with step feature |
Florence R. Pon |
2025-07-01 |
|
| 12266591 |
Choked flow cooling |
Mark Forsnes, Yuhong Cai, Florence R. Pon |
2025-04-01 |
|
| 12237300 |
Through-substrate void filling for an integrated circuit assembly |
Tyler Leuten, Eleanor Patricia Paras Rabadam |
2025-02-25 |
|
| 11948917 |
Die over mold stacked semiconductor package |
Florence R. Pon, James Zhang, Yuhong Cai, Tyler Leuten, William T. Glennan +1 more |
2024-04-02 |
$34,819,000 |
| 11901264 |
Choked flow cooling |
Mark Forsnes, Yuhong Cai, Florence R. Pon |
2024-02-13 |
|
| 11894334 |
Dual head capillary design for vertical wire bond |
Yuhong Cai, Bilal Khalaf |
2024-02-06 |
$35,892,000 |
| 11848292 |
Pad design for thermal fatigue resistance and interconnect joint reliability |
Sireesha Gogineni, Yuhong Cai |
2023-12-19 |
$50,836,000 |
| 11749653 |
Multi-die, vertical-wire package-in-package apparatus, and methods of making same |
Hyoung Il Kim, Florence R. Pon |
2023-09-05 |
$19,899,000 |
| 11710674 |
Embedded component and methods of making the same |
Bilal Khalaf, Dennis Sean Carr |
2023-07-25 |
$28,608,000 |
| 11694976 |
Bowl shaped pad |
Yuhong Cai, Sireesha Gogineni |
2023-07-04 |
|
| 11658079 |
Temporary interconnect for use in testing a semiconductor package |
Hyoung Il Kim, Florence R. Pon |
2023-05-23 |
$11,397,000 |
| 11652031 |
Shrinkable package assembly |
Florence R. Pon, Min-Tih Lai |
2023-05-16 |
$11,130,000 |
| 11569144 |
Semiconductor package design for solder joint reliability |
Yuhong Cai |
2023-01-31 |
$11,941,000 |
| 11566275 |
Chromatin immunocapture devices and methods of use |
Ryan C. Bailey, Joshua David Tice, Tamas Ordog, Jeong Heon Lee, Richard Martin Graybill +1 more |
2023-01-31 |
|
| 11545464 |
Diode for use in testing semiconductor packages |
Hyoung Il Kim, Florence R. Pon |
2023-01-03 |
$15,575,000 |
| 11476174 |
Solder mask design for delamination prevention |
James Zhang, Yuhong Cai |
2022-10-18 |
$11,317,000 |
| 11315843 |
Embedded component and methods of making the same |
Bilal Khalaf, Dennis Sean Carr |
2022-04-26 |
$25,630,000 |
| 11211314 |
Interposer for electrically connecting stacked integrated circuit device packages |
Hyoung Il Kim |
2021-12-28 |
$27,770,000 |
| 11056465 |
Semiconductor package having singular wire bond on bonding pads |
— |
2021-07-06 |
$31,309,000 |
| 10879152 |
Through mold via (TMV) using stacked modular mold rings |
Bilal Khalaf |
2020-12-29 |
$24,597,000 |
| 10597698 |
Chromatin immunocapture devices and methods of use |
Ryan C. Bailey, Joshua David Tice, Tamas Ordog, Jeong Heon Lee, Richard Martin Graybill +1 more |
2020-03-24 |
|
| 10573575 |
Semiconductor package with thermal fins |
Hyoung Il Kim, Florence R. Pon, Yuhong Cai, Min-Tih Lai, Leo Craft |
2020-02-25 |
$18,813,000 |
| 10366934 |
Face down dual sided chip scale memory package |
Chan H. Yoo, Akshay N. Singh, Liana Foster, Steven Eskildsen |
2019-07-30 |
$13,881,000 |
| 10332899 |
3D package having edge-aligned die stack with direct inter-die wire connections |
Florence R. Pon, Yong She |
2019-06-25 |
$17,766,000 |
| 10213782 |
Microfluidic devices |
Ryan C. Bailey, Steven Doonan |
2019-02-26 |
|
