Issued Patents All Time
Showing 25 most recent of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400877 | Semiconductor devices with flexible reinforcement structure | Owen R. Fay | 2025-08-26 |
| 12277056 | Memory device interface and method | Brent Keeth, Owen R. Fay, Roy Greeff, Matthew B. Leslie | 2025-04-15 |
| 12253943 | Memory device interface and method | Brent Keeth, Owen R. Fay, Roy Greeff, Matthew B. Leslie | 2025-03-18 |
| 12243801 | Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same | Hyunsuk Chun, Xiaopeng Qu | 2025-03-04 |
| 12230583 | Interposers for microelectronic devices | Owen R. Fay | 2025-02-18 |
| 12218101 | Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same | Owen R. Fay, Mark E. Tuttle | 2025-02-04 |
| 12218119 | Stacked interposer structures | Owen R. Fay | 2025-02-04 |
| 12211814 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Koustav Sinha | 2025-01-28 |
| 12199001 | Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same | Owen R. Fay | 2025-01-14 |
| 12199068 | Methods of forming microelectronic device assemblies and packages | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Bret K. Street +2 more | 2025-01-14 |
| 12170275 | Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer | Owen R. Fay | 2024-12-17 |
| 12112830 | Methods for memory power management and memory devices and systems employing the same | Eric J. Stave, George E. Pax, Yogesh Sharma, Gregory A. King, Randon K. Richards +1 more | 2024-10-08 |
| 12062607 | Low cost three-dimensional stacking semiconductor assemblies | Owen R. Fay | 2024-08-13 |
| 11990350 | Semiconductor devices with flexible reinforcement structure | Owen R. Fay | 2024-05-21 |
| 11929349 | Semiconductor device having laterally offset stacked semiconductor dies | Ashok Pachamuthu | 2024-03-12 |
| 11887920 | Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methods | Hyunsuk Chun, Tracy N. Tennant | 2024-01-30 |
| 11868253 | Memory device interface and method | Brent Keeth, Owen R. Fay, Roy Greeff, Matthew B. Leslie | 2024-01-09 |
| 11824010 | Interposers for microelectronic devices | Owen R. Fay | 2023-11-21 |
| 11791315 | Semiconductor assemblies including thermal circuits and methods of manufacturing the same | Owen R. Fay, Eiichi Nakano | 2023-10-17 |
| 11789890 | Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilities | Thomas H. Kinsley, George E. Pax, Timothy M. Hollis, Yogesh Sharma, Randon K. Richards +2 more | 2023-10-17 |
| 11784166 | Dual sided fan-out package having low warpage across all temperatures | Mark E. Tuttle | 2023-10-10 |
| 11728307 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Koustav Sinha | 2023-08-15 |
| 11721742 | Memory modules and memory packages including graphene layers for thermal management | George E. Pax, Yogesh Sharma, Gregory A. King, Thomas H. Kinsley, Randon K. Richards | 2023-08-08 |
| 11688658 | Semiconductor device | Hyunsuk Chun, Shams U. Arifeen, Tracy N. Tennant | 2023-06-27 |
| 11664291 | Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same | Owen R. Fay | 2023-05-30 |